微控制器、微处理器、FPGA 模块

制造商 系列 包装 产品状态 模块/板类型 核心处理器 协处理器 速度 闪存大小 RAM 大小 连接器类型 尺寸 / 尺寸 工作温度





































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 制造商型号 库存情况 价格 数量 数据手册 系列 包装 产品状态 模块/板类型 核心处理器 协处理器 速度 闪存大小 RAM 大小 连接器类型 尺寸 / 尺寸 工作温度
TE0808-05-6BE21-F

TE0808-05-6BE21-F

ULTRASOM+ MPSOC MODULE WITH AMD

Trenz Electronic GmbH

3,124
TE0808-05-6BE21-F

数据手册

- Bulk Active MPU Core Zynq™ UltraScale+™ ZU6EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) 4 x 160 Pin 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0818-01-6BE21-A

TE0818-01-6BE21-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

4,121
TE0818-01-6BE21-A

数据手册

Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0818-02-6BE81-A

TE0818-02-6BE81-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

2,233
TE0818-02-6BE81-A

数据手册

Zynq UltraScale+ Bulk Active MPU Core Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-6BE21-A

TE0808-05-6BE21-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,803
TE0808-05-6BE21-A

数据手册

TE0808 Bulk Discontinued at Digi-Key MPU Core Zynq™ UltraScale+™ ZU6EG-1FFVC900E - - 128MB 4GB 4 x 160 Pin 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-6BE81-A

TE0808-05-6BE81-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,315
TE0808-05-6BE81-A

数据手册

- Bulk Discontinued at Digi-Key - - - - - - - - -
TE0808-05-6BE81-E

TE0808-05-6BE81-E

ULTRASOM+ MPSOC MODULE WITH AMD

Trenz Electronic GmbH

4,167
TE0808-05-6BE81-E

数据手册

- Bulk Active - - - - - - - - -
TE0808-04-6BE21-L

TE0808-04-6BE21-L

IC MOD SOM MPSOC 4GB XCZU6EG

Trenz Electronic GmbH

3,891
TE0808-04-6BE21-L

数据手册

TE0808 Bulk Active MPU Core Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0808-05-6BE81-AK

TE0808-05-6BE81-AK

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,954
TE0808-05-6BE81-AK

数据手册

- Bulk Discontinued at Digi-Key - - - - - - - - -
TE0808-05-6BE21-AK

TE0808-05-6BE21-AK

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,098
TE0808-05-6BE21-AK

数据手册

TE0808 Bulk Discontinued at Digi-Key MPU Core Zynq™ UltraScale+™ ZU6EG-E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-04-6BE21-AK

TE0808-04-6BE21-AK

IC MOD SOM MPSOC 4GB ZU6EG

Trenz Electronic GmbH

2,627
TE0808-04-6BE21-AK

数据手册

TE0808 Bulk Active MPU Core Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
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