| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 包装 | 产品状态 | 模块/板类型 | 核心处理器 | 协处理器 | 速度 | 闪存大小 | RAM 大小 | 连接器类型 | 尺寸 / 尺寸 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TE0820-05-5DI81MAMPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH |
2,875 |
|
数据手册 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - |
|
TE0813-01-5DI21-AMPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH |
4,294 |
|
数据手册 |
Zynq® UltraScale+™ | Bulk | Active | MPU Core | Zynq UltraScale+ XCZU5EV-1SFVC784I | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | -40°C ~ 85°C |
|
TE0813-02-5DI81-AMPSOC MODULE WITH AMD ZYNQ ULTRA Trenz Electronic GmbH |
3,845 |
|
数据手册 |
Zynq UltraScale+ | Bulk | Active | MPU Core | Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784I | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 4 x 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | -40°C ~ 85°C |
|
AM0010-02-5DI21MAMPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH |
1,344 |
|
数据手册 |
Zynq® UltraScale+™ | Bulk | Active | MPU Core | Zynq™ UltraScale+™ ZU5EV-1I | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket | 2.220" L x 1.575" W (56.40mm x 40.00mm) | -40°C ~ 85°C |
|
TE0741-04-G2I-1-AMODULE FPGA KINTEX Trenz Electronic GmbH |
1,897 |
|
数据手册 |
- | Box | Obsolete | FPGA Core | Xilinx Kintex-7 FPGA XC7K410T-2FBG676I | - | - | 32MB | - | Board-to-Board (BTB) Socket | 1.970" L x 1.570" W (50.00mm x 40.00mm) | -40°C ~ 85°C |
|
TE0818-01-9GI21-AULTRASOM+ MPSOC MODULE WITH ZYNQ Trenz Electronic GmbH |
1,929 |
|
数据手册 |
Zynq® UltraScale+™ | Bulk | Active | MPU Core | Zynq UltraScale+ XCZU9EG-2FFVC900I | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | -40°C ~ 85°C |
|
TE0818-01-BBE21-AULTRASOM+ MPSOC MODULE WITH ZYNQ Trenz Electronic GmbH |
2,952 |
|
数据手册 |
Zynq® UltraScale+™ | Bulk | Active | MPU Core | Zynq UltraScale+ XCZU15EG-1FFVC900E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
TE0841-02-31I21-AIC MODULE Trenz Electronic GmbH |
3,974 |
|
数据手册 |
TE0841 | Bulk | Discontinued at Digi-Key | FPGA Core | Kintex UltraScale KU035 | - | - | 64MB | 2GB | B2B | 1.970" L x 1.570" W (50.00mm x 40.00mm) | -40°C ~ 85°C |
|
TE0808-05-9GI81-AULTRASOM+ MPSOC MODULE WITH ZYNQ Trenz Electronic GmbH |
2,017 |
|
数据手册 |
- | Bulk | Discontinued at Digi-Key | - | - | - | - | - | - | - | - | - |
|
TE0745-02-92I31-AMOD SOM DDR3L 1GB Trenz Electronic GmbH |
1,161 |
|
数据手册 |
TE0745 | Bulk | Active | MCU, FPGA | ARM Cortex-A9 | Zynq-7000 (Z-7045) | - | 64MB | 1GB | Board-to-Board (BTB) Socket - 480 | 2.050" L x 2.990" W (52.00mm x 76.00mm) | -40°C ~ 85°C |