微控制器、微处理器、FPGA 模块

制造商 系列 包装 产品状态 模块/板类型 核心处理器 协处理器 速度 闪存大小 RAM 大小 连接器类型 尺寸 / 尺寸 工作温度





































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 制造商型号 库存情况 价格 数量 数据手册 系列 包装 产品状态 模块/板类型 核心处理器 协处理器 速度 闪存大小 RAM 大小 连接器类型 尺寸 / 尺寸 工作温度
TE0820-05-5DI81MA

TE0820-05-5DI81MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

2,875
TE0820-05-5DI81MA

数据手册

- Bulk Active - - - - - - - - -
TE0813-01-5DI21-A

TE0813-01-5DI21-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

4,294
TE0813-01-5DI21-A

数据手册

Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU5EV-1SFVC784I - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
TE0813-02-5DI81-A

TE0813-02-5DI81-A

MPSOC MODULE WITH AMD ZYNQ ULTRA

Trenz Electronic GmbH

3,845
TE0813-02-5DI81-A

数据手册

Zynq UltraScale+ Bulk Active MPU Core Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784I - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 240 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
AM0010-02-5DI21MA

AM0010-02-5DI21MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

1,344
AM0010-02-5DI21MA

数据手册

Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ ZU5EV-1I - - 128MB 4GB Board-to-Board (BTB) Socket 2.220" L x 1.575" W (56.40mm x 40.00mm) -40°C ~ 85°C
TE0741-04-G2I-1-A

TE0741-04-G2I-1-A

MODULE FPGA KINTEX

Trenz Electronic GmbH

1,897
TE0741-04-G2I-1-A

数据手册

- Box Obsolete FPGA Core Xilinx Kintex-7 FPGA XC7K410T-2FBG676I - - 32MB - Board-to-Board (BTB) Socket 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0818-01-9GI21-A

TE0818-01-9GI21-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,929
TE0818-01-9GI21-A

数据手册

Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU9EG-2FFVC900I - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
TE0818-01-BBE21-A

TE0818-01-BBE21-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

2,952
TE0818-01-BBE21-A

数据手册

Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU15EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0841-02-31I21-A

TE0841-02-31I21-A

IC MODULE

Trenz Electronic GmbH

3,974
TE0841-02-31I21-A

数据手册

TE0841 Bulk Discontinued at Digi-Key FPGA Core Kintex UltraScale KU035 - - 64MB 2GB B2B 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0808-05-9GI81-A

TE0808-05-9GI81-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

2,017
TE0808-05-9GI81-A

数据手册

- Bulk Discontinued at Digi-Key - - - - - - - - -
TE0745-02-92I31-A

TE0745-02-92I31-A

MOD SOM DDR3L 1GB

Trenz Electronic GmbH

1,161
TE0745-02-92I31-A

数据手册

TE0745 Bulk Active MCU, FPGA ARM Cortex-A9 Zynq-7000 (Z-7045) - 64MB 1GB Board-to-Board (BTB) Socket - 480 2.050" L x 2.990" W (52.00mm x 76.00mm) -40°C ~ 85°C
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