| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 包装 | 产品状态 | 模块/板类型 | 核心处理器 | 协处理器 | 速度 | 闪存大小 | RAM 大小 | 连接器类型 | 尺寸 / 尺寸 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TE0808-05-9BE81-AULTRASOM+ MPSOC MODULE WITH ZYNQ Trenz Electronic GmbH |
1,938 |
|
数据手册 |
TE0808 | Bulk | Discontinued at Digi-Key | MPU Core | - | - | - | 128MB | 4GB | - | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - |
|
TE0808-05-9BE21-EULTRASOM+ MPSOC MODULE WITH AMD Trenz Electronic GmbH |
4,206 |
|
数据手册 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - |
|
TE0807-03-4AI21-AMPSOC ZYNQ USCALE 4GB DDR4 Trenz Electronic GmbH |
2,217 |
|
数据手册 |
TE0807 | Box | Discontinued at Digi-Key | MPU Core | Zynq UltraScale+ XCZU4CG-1FBVB900I | - | - | 128MB | 4GB | B2B | 2.050" L x 2.990" W (52.00mm x 76.00mm) | -40°C ~ 85°C |
|
TE0808-04-9BE21-LIC MOD SOM MPSOC 4GB XCZU9EG Trenz Electronic GmbH |
1,468 |
|
数据手册 |
TE0808 | Box | Active | MPU Core | - | - | - | 128MB | 4GB | B2B | - | - |
|
TE0808-05-9BE21-LZULTRASOM+ MPSOC MODULE WITH AMD Trenz Electronic GmbH |
3,688 |
|
数据手册 |
Zynq UltraScale+ | Bulk | Obsolete | MPU Core | Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 4 x 160 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
TE0818-02-9BE81-AULTRASOM+ MPSOC MODULE WITH AMD Trenz Electronic GmbH |
1,036 |
|
数据手册 |
Zynq UltraScale+ | Bulk | Active | MPU Core | Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 4 x 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
TE0808-05-9BE81-AKULTRASOM+ MPSOC MODULE WITH ZYNQ Trenz Electronic GmbH |
1,118 |
|
数据手册 |
- | Bulk | Discontinued at Digi-Key | - | - | - | - | - | - | - | - | - |
|
TE0807-03-7DI21-AMPSOC ZYNQ USCALE 4GB DDR4 Trenz Electronic GmbH |
3,063 |
|
数据手册 |
TE0807 | Box | Discontinued at Digi-Key | MPU Core | Zynq UltraScale+ XCZU7EV-1FBVB900I | - | - | 128MB | 4GB | B2B | 2.050" L x 2.990" W (52.00mm x 76.00mm) | -40°C ~ 85°C |
|
TE0741-05-G2C-1-AMODULE FPGA KINTEX Trenz Electronic GmbH |
1,865 |
|
数据手册 |
Kintex™-7 | Bulk | Active | FPGA | Xilinx Kintex-7 FPGA XC7K410T-2FBG676C | - | - | 32MB | - | Board-to-Board (BTB) Socket | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 0°C ~ 70°C |
|
TE0841-02-31C21-AIC MODULE Trenz Electronic GmbH |
3,136 |
|
数据手册 |
TE0841 | Bulk | Discontinued at Digi-Key | FPGA Core | Kintex UltraScale KU035 | - | - | 64MB | 2GB | B2B | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 0°C ~ 70°C |