微控制器、微处理器、FPGA 模块

制造商 系列 包装 产品状态 模块/板类型 核心处理器 协处理器 速度 闪存大小 RAM 大小 连接器类型 尺寸 / 尺寸 工作温度





































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 制造商型号 库存情况 价格 数量 数据手册 系列 包装 产品状态 模块/板类型 核心处理器 协处理器 速度 闪存大小 RAM 大小 连接器类型 尺寸 / 尺寸 工作温度
TE0807-03-5AI21-A

TE0807-03-5AI21-A

MPSOC ZYNQ USCALE 4GB DDR4

Trenz Electronic GmbH

4,840
TE0807-03-5AI21-A

数据手册

- Box Active - - - - - - - - -
TE0803-04-5DE11-A

TE0803-04-5DE11-A

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH

1,094
TE0803-04-5DE11-A

数据手册

TE0803 Bulk Active MPU Core Zynq UltraScale+ XCZU5EV-1SFVC784E - - 128MB 2GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0813-01-5DE11-A

TE0813-01-5DE11-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

2,502
TE0813-01-5DE11-A

数据手册

Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU5EV-1SFVC784E - - 128MB 2GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0817-01-4AI21-A

TE0817-01-4AI21-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

4,229
TE0817-01-4AI21-A

数据手册

Zynq® UltraScale+™ Bulk Obsolete MPU Core Zynq UltraScale+ XCZU4CG-1FBVB900I - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
TE0813-02-5DE81-A

TE0813-02-5DE81-A

MPSOC MODULE WITH AMD ZYNQ ULTRA

Trenz Electronic GmbH

4,640
TE0813-02-5DE81-A

数据手册

Zynq UltraScale+ Bulk Active MPU Core Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784E - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-9BE81-L

TE0808-05-9BE81-L

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,513
TE0808-05-9BE81-L

数据手册

TE0808 Bulk Active MPU Core - - - 128MB 4GB - 2.990" L x 2.050" W (76.00mm x 52.00mm) -
TE0808-05-9BE21-L

TE0808-05-9BE21-L

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

4,646
TE0808-05-9BE21-L

数据手册

TE0808 Bulk Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU9EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-9BE21-F

TE0808-05-9BE21-F

ULTRASOM+ MPSOC MODULE WITH AMD

Trenz Electronic GmbH

1,690
TE0808-05-9BE21-F

数据手册

- Bulk Active - - - - - - - - -
TE0818-01-9BE21-A

TE0818-01-9BE21-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,513
TE0818-01-9BE21-A

数据手册

Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU9EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
AM0010-02-5DE21MA

AM0010-02-5DE21MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

1,495
AM0010-02-5DE21MA

数据手册

Zynq® UltraScale+™ Bulk Active MPU Core Zynq™ UltraScale+™ ZU5EV-1E - - 128MB 4GB Board-to-Board (BTB) Socket 2.220" L x 1.575" W (56.40mm x 40.00mm) 0°C ~ 85°C
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