微控制器、微处理器、FPGA 模块

制造商 系列 包装 产品状态 模块/板类型 核心处理器 协处理器 速度 闪存大小 RAM 大小 连接器类型 尺寸 / 尺寸 工作温度





































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 制造商型号 库存情况 价格 数量 数据手册 系列 包装 产品状态 模块/板类型 核心处理器 协处理器 速度 闪存大小 RAM 大小 连接器类型 尺寸 / 尺寸 工作温度
TE0817-01-7DE21-A

TE0817-01-7DE21-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

1,011
TE0817-01-7DE21-A

数据手册

Zynq® UltraScale+™ Bulk Obsolete MPU Core Zynq UltraScale+ XCZU7EV-1FBVB900E - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0782-02-82I33MA

TE0782-02-82I33MA

IC MODULE CORTEX

Trenz Electronic GmbH

1,003
TE0782-02-82I33MA

数据手册

TE0782 Bulk Active MCU, FPGA ARM Cortex-A9 Zynq-7000 (Z-7035) - 32MB 1GB Board-to-Board (BTB) Socket 3.350" L x 3.350" W (85.00mm x 85.00mm) -40°C ~ 85°C
TE0807-03-7DE21-A

TE0807-03-7DE21-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

4,922
TE0807-03-7DE21-A

数据手册

TE0807 Bulk Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU7EV-1FBVB900E - - 128MB 4GB 4 x 160 Pin 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0745-02-92I31-F

TE0745-02-92I31-F

MOD SOM DDR3L 1GB

Trenz Electronic GmbH

4,651
TE0745-02-92I31-F

数据手册

TE0745 Bulk Active MCU, FPGA ARM Cortex-A9 Zynq-7000 (Z-7045) - 64MB 1GB Board-to-Board (BTB) Socket - 480 2.050" L x 2.990" W (52.00mm x 76.00mm) -40°C ~ 85°C
TE0807-03-7DE21-AK

TE0807-03-7DE21-AK

MPSOC MODULE TE0807 WITH ZYNQ UL

Trenz Electronic GmbH

3,489
TE0807-03-7DE21-AK

数据手册

TE0807 Bulk Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU7EV-1FBVB900E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0745-02-93E31-A

TE0745-02-93E31-A

MOD SOM DDR3L 1GB

Trenz Electronic GmbH

3,380
TE0745-02-93E31-A

数据手册

TE0745 Bulk Active MCU, FPGA ARM Cortex-A9 Zynq-7000 (Z-7045) - 64MB 1GB Board-to-Board (BTB) Socket - 480 2.050" L x 2.990" W (52.00mm x 76.00mm) -40°C ~ 85°C
TE0808-05-BBE21-AZ

TE0808-05-BBE21-AZ

MODULE MPSOC 2GB DDR4

Trenz Electronic GmbH

2,396
TE0808-05-BBE21-AZ

数据手册

- Box Discontinued at Digi-Key FPGA Core Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E - - 128MB 2GB Board-to-Board (BTB) Socket 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0817-01-7AI21-A

TE0817-01-7AI21-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

4,853
TE0817-01-7AI21-A

数据手册

Zynq® UltraScale+™ Bulk Obsolete MPU Core Zynq UltraScale+ XCZU7CG-1FBVB900I - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
TE0745-03-93E31-A

TE0745-03-93E31-A

SOM WITH AMD ZYNQ 7045-3E, 1 GBY

Trenz Electronic GmbH

2,084
TE0745-03-93E31-A

数据手册

Zynq Bulk Active MPU Core ARM Cortex-A9 Xilinx Zynq 7045 SoC XC7Z045-3FFG676E - 64MB 1GB Samtec ST5 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0745-02-93E31-AK

TE0745-02-93E31-AK

SOM WITH XILINX ZYNQ 7045-3E AND

Trenz Electronic GmbH

2,036
TE0745-02-93E31-AK

数据手册

TE0745 Bulk Active MPU Core Zynq™ 7045 SoC XC7Z045-3FFG676E ARM Cortex-A9 - 64MB 1GB Board-to-Board (BTB) Socket 2.990" L x 2.050" W (76.00mm x 52.00mm) -40°C ~ 85°C
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