| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 包装 | 产品状态 | 模块/板类型 | 核心处理器 | 协处理器 | 速度 | 闪存大小 | RAM 大小 | 连接器类型 | 尺寸 / 尺寸 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TE0813-01-4AE11-AMPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH |
4,404 |
|
数据手册 |
Zynq® UltraScale+™ | Bulk | Active | MPU Core | Zynq UltraScale+ XCZU4CG-1SFVC784E | - | - | 128MB | 2GB | Board-to-Board (BTB) Socket - 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
TE0813-02-4AE81-AMPSOC MODULE WITH AMD ZYNQ ULTRA Trenz Electronic GmbH |
3,142 |
|
数据手册 |
Zynq UltraScale+ | Bulk | Active | MPU Core | Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 4 x 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
TE0813-01-3BE11-AMPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH |
3,799 |
|
数据手册 |
Zynq® UltraScale+™ | Bulk | Active | MPU Core | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | - | 128MB | 2GB | Board-to-Board (BTB) Socket - 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
TE0813-02-3BE81-AMPSOC MODULE WITH AMD ZYNQ ULTRA Trenz Electronic GmbH |
2,821 |
|
数据手册 |
Zynq UltraScale+ | Bulk | Active | MPU Core | Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 4 x 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
TE0821-01-3BE21MLMPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH |
1,709 |
|
数据手册 |
TE0823 | Bulk | Discontinued at Digi-Key | MPU Core | Zynq UltraScale+ XCZU3EG-1SFVC784E | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 128MB | 2GB | 2 x 100 Pin | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 0°C ~ 85°C |
|
TE0820-05-3BE81MAMPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH |
1,289 |
|
数据手册 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - |
|
TE0821-01-3BE21MAMPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH |
4,195 |
|
数据手册 |
TE0823 | Bulk | Discontinued at Digi-Key | MPU Core | Zynq UltraScale+ XCZU3EG-1SFVC784E | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 128MB | 2GB | 2 x 100 Pin | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 0°C ~ 85°C |
|
AM0010-02-4AE21MAMPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH |
2,954 |
|
数据手册 |
Zynq® UltraScale+™ | Bulk | Active | MPU Core | Zynq™ UltraScale+™ ZU4CG-1E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket | 2.205" L x 1.575" W (56.00mm x 40.00mm) | 0°C ~ 85°C |
|
TE0820-05-3BI21MLMOD MPSOC 2GB DDR4 Trenz Electronic GmbH |
1,446 |
|
数据手册 |
TE0820 | Bulk | Last Time Buy | MPU Core | - | - | - | 8GB eMMC, 128MB QSPI | 2GB | - | - | - |
|
TE0821-01-3AE31PAMPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH |
2,492 |
|
数据手册 |
TE0823 | Bulk | Discontinued at Digi-Key | MPU Core | Zynq UltraScale+ XCZU3CG-1SFVC784E | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 128MB | 4GB | 2 x 100 Pin | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 0°C ~ 85°C |