| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 可编程 | 存储类型 | 存储格式 | 技术 | 存储容量 | 存储组织 | 存储接口 | 时钟频率 | 写周期时间 - 字,页 | 访问时间 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
W66CM2NQUAGJ TRIC DRAM 4GBIT LVSTL 11 200WFBGA Winbond Electronics |
3,302 |
|
数据手册 |
- | 200-WFBGA | Tape & Reel (TR) | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 4Gbit | 128M x 32 | LVSTL_11 | 1.866 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |
|
W29N04GVBIAFIC FLASH 4GBIT ONFI 63VFBGA Winbond Electronics |
1,458 |
|
数据手册 |
- | 63-VFBGA | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 4Gbit | 512M x 8 | ONFI | - | 25ns, 700µs | 25 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 63-VFBGA (9x11) |
|
W35N04JWTBICIC FLASH 4GBIT SPI/OCT 24TFBGA Winbond Electronics |
2,777 |
|
数据手册 |
- | 24-TBGA | Tray | Active | - | Non-Volatile | FLASH | FLASH - NAND (SLC) | 4Gbit | 512M x 8 | SPI - Octal I/O | 166 MHz | - | - | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 24-TFBGA (8x6) |
|
W35N04JWTBIFIC FLASH 4GBIT SPI/OCT 24TFBGA Winbond Electronics |
4,747 |
|
数据手册 |
- | 24-TBGA | Tray | Active | - | Non-Volatile | FLASH | FLASH - NAND (SLC) | 4Gbit | 512M x 8 | SPI - Octal I/O | 166 MHz | - | - | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 24-TFBGA (8x6) |
|
W66CL2NQUAHJ TRIC DRAM 4GBIT LVSTL 11 200WFBGA Winbond Electronics |
3,730 |
|
数据手册 |
- | 200-WFBGA | Tape & Reel (TR) | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 4Gbit | 128M x 32 | LVSTL_11 | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |
|
W972GG6KB-25 TRIC DRAM 2GBIT 84-WBGA Winbond Electronics |
2,574 |
|
数据手册 |
- | 84-TFBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM - DDR2 | 2Gbit | 128M x 16 | - | 400 MHz | 15ns | 57.5 ns | 1.7V ~ 1.9V | 0°C ~ 85°C (TC) | - | - | Surface Mount | 84-WBGA (8x12.5) |
|
W972GG8KS-25 TRIC DRAM 2GBIT 60-WBGA Winbond Electronics |
3,247 |
|
数据手册 |
- | 60-TFBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM - DDR2 | 2Gbit | 256M x 8 | - | 400 MHz | 15ns | 57.5 ns | 1.7V ~ 1.9V | 0°C ~ 85°C (TC) | - | - | Surface Mount | 60-WBGA (8x9.5) |
|
W972GG8KS-18 TRIC DRAM 2GBIT 60-WBGA Winbond Electronics |
3,441 |
|
数据手册 |
- | 60-TFBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM - DDR2 | 2Gbit | 256M x 8 | - | 533 MHz | 15ns | 58.125 ns | 1.7V ~ 1.9V | 0°C ~ 85°C (TC) | - | - | Surface Mount | 60-WBGA (8x9.5) |
|
W66CM2NQUAHJ TRIC DRAM 4GBIT LVSTL 11 200WFBGA Winbond Electronics |
4,069 |
|
数据手册 |
- | 200-WFBGA | Tape & Reel (TR) | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 4Gbit | 128M x 32 | LVSTL_11 | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |
|
W25Q01JVTBIQ TRIC FLASH 1GBIT SPI/QUAD 24TFBGA Winbond Electronics |
3,029 |
|
数据手册 |
SpiFlash® | 24-TBGA | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 1Gbit | 128M x 8 | SPI - Quad I/O | 133 MHz | 3.5ms | 7.5 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 24-TFBGA (8x6) |