| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 可编程 | 存储类型 | 存储格式 | 技术 | 存储容量 | 存储组织 | 存储接口 | 时钟频率 | 写周期时间 - 字,页 | 访问时间 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
W29N04KZBIBFIC FLASH 4GBIT ONFI 63VFBGA Winbond Electronics |
4,771 |
|
数据手册 |
- | 63-VFBGA | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 4Gbit | 512M x 8 | ONFI | - | 25ns, 700µs | 25 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 63-VFBGA (9x11) |
|
W25Q512NWEIMIC FLASH 512MBIT SPI/QUAD 8WSON Winbond Electronics |
2,026 |
|
数据手册 |
SpiFlash® | 8-WDFN Exposed Pad | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 512Mbit | 64M x 8 | SPI - Quad I/O, QPI, DTR | 133 MHz | 3ms | 6 ns | 1.65V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 8-WSON (8x6) |
|
W66CL2NQUAFJ TRIC DRAM 4GBIT LVSTL 11 200WFBGA Winbond Electronics |
2,888 |
|
数据手册 |
- | 200-WFBGA | Tape & Reel (TR) | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 4Gbit | 128M x 32 | LVSTL_11 | 1.6 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |
|
W66CM2NQUAFJ TRIC DRAM 4GBIT LVSTL 11 200WFBGA Winbond Electronics |
4,320 |
|
数据手册 |
- | 200-WFBGA | Tape & Reel (TR) | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 4Gbit | 128M x 32 | LVSTL_11 | 1.6 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |
|
W25Q01JVZEIQ TRIC FLASH 1GBIT SPI/QUAD 8WSON Winbond Electronics |
1,939 |
|
数据手册 |
SpiFlash® | 8-WDFN Exposed Pad | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 1Gbit | 128M x 8 | SPI - Quad I/O | 133 MHz | 3.5ms | 7.5 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 8-WSON (8x6) |
|
W25Q01JVZEIM TRIC FLASH 1GBIT SPI/QUAD 8WSON Winbond Electronics |
1,729 |
|
数据手册 |
SpiFlash® | 8-WDFN Exposed Pad | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 1Gbit | 128M x 8 | SPI - Quad I/O, QPI, DTR | 133 MHz | 3.5ms | 7.5 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 8-WSON (8x6) |
|
W25Q01JVZEIN TRSPIFLASH, 1G-BIT, 4KB UNIFORM SE Winbond Electronics |
1,830 |
|
数据手册 |
- | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
W35N04JWTBIC TRIC FLASH 4GBIT SPI/OCT 24TFBGA Winbond Electronics |
4,595 |
|
数据手册 |
- | 24-TBGA | Tape & Reel (TR) | Active | - | Non-Volatile | FLASH | FLASH - NAND (SLC) | 4Gbit | 512M x 8 | SPI - Octal I/O | 166 MHz | - | - | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 24-TFBGA (8x6) |
|
W35N04JWTBIF TRIC FLASH 4GBIT SPI/OCT 24TFBGA Winbond Electronics |
3,598 |
|
数据手册 |
- | 24-TBGA | Tape & Reel (TR) | Active | - | Non-Volatile | FLASH | FLASH - NAND (SLC) | 4Gbit | 512M x 8 | SPI - Octal I/O | 166 MHz | - | - | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 24-TFBGA (8x6) |
|
W66CL2NQUAGJ TRIC DRAM 4GBIT LVSTL 11 200WFBGA Winbond Electronics |
3,840 |
|
数据手册 |
- | 200-WFBGA | Tape & Reel (TR) | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 4Gbit | 128M x 32 | LVSTL_11 | 1.866 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |