| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 可编程 | 存储类型 | 存储格式 | 技术 | 存储容量 | 存储组织 | 存储接口 | 时钟频率 | 写周期时间 - 字,页 | 访问时间 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
W71NW11GE1EWIC FLASH RAM 1GBIT 121WFBGA Winbond Electronics |
4,053 |
|
数据手册 |
- | 121-WFBGA | Tray | Not For New Designs | Not Verified | Non-Volatile, Volatile | FLASH, RAM | FLASH - NAND, DRAM - LPDDR2 | 1Gbit (NAND), 512Mbit (LPDDR2) | - | - | - | - | - | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 121-WFBGA (8x8) |
|
W25R512JVEINIC FLASH 512MBIT SPI 8WSON Winbond Electronics |
4,919 |
|
数据手册 |
- | 8-WDFN Exposed Pad | Tube | Active | - | Non-Volatile | FLASH | FLASH - NOR (SLC) | 512Mbit | 64M x 8 | SPI | 133 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C | - | - | Surface Mount | 8-WSON (8x6) |
|
W66BL6NBUAGJIC DRAM 2GBIT LVSTL 11 200WFBGA Winbond Electronics |
4,534 |
|
数据手册 |
- | 200-WFBGA | Tray | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 2Gbit | 128M x 16 | LVSTL_11 | 1.866 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |
|
W25N04KWZEIUIC FLASH 4GBIT SPI/QUAD 8WSON Winbond Electronics |
1,989 |
|
数据手册 |
SpiFlash® | 8-WDFN Exposed Pad | Tube | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 4Gbit | 512M x 8 | SPI - Quad I/O | 104 MHz | 700µs | 8 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 8-WSON (8x6) |
|
W29N04KWSIBFIC FLASH 4GBIT ONFI 48TSOP Winbond Electronics |
2,199 |
|
数据手册 |
- | 48-TFSOP (0.724", 18.40mm Width) | Tray | Active | - | Non-Volatile | FLASH | FLASH - NAND (SLC) | 4Gbit | 256M x 16 | ONFI | - | 25ns, 700µs | 25 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 48-TSOP |
|
W29N04KWSIBGIC FLASH 4GBIT ONFI 48TSOP Winbond Electronics |
2,321 |
|
数据手册 |
- | 48-TFSOP (0.724", 18.40mm Width) | Tray | Active | - | Non-Volatile | FLASH | FLASH - NAND (SLC) | 4Gbit | 256M x 16 | ONFI | - | 35ns, 700µs | 25 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 48-TSOP |
|
W25M02GWZEIGIC FLASH 2GBIT SPI/QUAD 8WSON Winbond Electronics |
3,374 |
|
数据手册 |
SpiFlash® | 8-WDFN Exposed Pad | Tube | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 2Gbit | 256M x 8 | SPI - Quad I/O | 104 MHz | 700µs | - | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 8-WSON (8x6) |
|
W97BH2KBVX2IIC DRAM 2GBIT PARALLEL 134VFBGA Winbond Electronics |
2,843 |
|
数据手册 |
- | 134-VFBGA | Tray | Obsolete | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 2Gbit | 64M x 32 | Parallel | 400 MHz | 15ns | - | 1.14V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 134-VFBGA (10x11.5) |
|
W66BM6NBUAGJIC DRAM 2GBIT LVSTL 11 200WFBGA Winbond Electronics |
3,911 |
|
数据手册 |
- | 200-WFBGA | Tray | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 2Gbit | 128M x 16 | LVSTL_11 | 1.866 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |
|
W29N04KWBIBGIC FLASH 4GBIT ONFI 63VFBGA Winbond Electronics |
2,297 |
|
数据手册 |
- | 63-VFBGA | Tray | Active | - | Non-Volatile | FLASH | FLASH - NAND (SLC) | 4Gbit | 256M x 16 | ONFI | - | 35ns, 700µs | 25 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 63-VFBGA (9x11) |