IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 制造商型号 库存情况 价格 数量 数据手册 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APA-648-G-Q

APA-648-G-Q

ADAPTER PLUG

Samtec Inc.

4,294
APA-648-G-Q

数据手册

APA Tube Active - 48 (2 x 24) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
514-87-420M26-001148

514-87-420M26-001148

CONN SOCKET BGA 420POS GOLD

Preci-Dip

2,620
514-87-420M26-001148

数据手册

514 Bulk Active BGA 420 (26 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
558-10-272M20-001104

558-10-272M20-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

3,217
558-10-272M20-001104

数据手册

558 Bulk Active BGA 272 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
APH-1438-G-R

APH-1438-G-R

APH-1438-G-R

Samtec Inc.

3,226
APH-1438-G-R

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0538-G-R

APH-0538-G-R

APH-0538-G-R

Samtec Inc.

1,479
APH-0538-G-R

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1538-G-R

APH-1538-G-R

APH-1538-G-R

Samtec Inc.

4,718
APH-1538-G-R

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0638-G-R

APH-0638-G-R

APH-0638-G-R

Samtec Inc.

2,153
APH-0638-G-R

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1638-G-R

APH-1638-G-R

APH-1638-G-R

Samtec Inc.

3,611
APH-1638-G-R

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1138-G-R

APH-1138-G-R

APH-1138-G-R

Samtec Inc.

2,595
APH-1138-G-R

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0338-G-R

APH-0338-G-R

APH-0338-G-R

Samtec Inc.

1,144
APH-0338-G-R

数据手册

* - Active - - - - - - - - - - - - - - -
518-77-272M20-001105

518-77-272M20-001105

CONN SOCKET PGA 272POS GOLD

Preci-Dip

4,936
518-77-272M20-001105

数据手册

518 Bulk Active PGA 272 (20 x 20) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
24-6572-16

24-6572-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

4,250
24-6572-16

数据手册

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
24-6574-16

24-6574-16

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

1,440
24-6574-16

数据手册

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
558-10-292M20-001101

558-10-292M20-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

1,453
558-10-292M20-001101

数据手册

558 Bulk Active PGA 292 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
APH-1340-G-H

APH-1340-G-H

APH-1340-G-H

Samtec Inc.

1,945
APH-1340-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1840-G-H

APH-1840-G-H

APH-1840-G-H

Samtec Inc.

4,365
APH-1840-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0940-G-H

APH-0940-G-H

APH-0940-G-H

Samtec Inc.

2,993
APH-0940-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1540-G-H

APH-1540-G-H

APH-1540-G-H

Samtec Inc.

4,869
APH-1540-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1040-G-H

APH-1040-G-H

APH-1040-G-H

Samtec Inc.

2,365
APH-1040-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1740-G-H

APH-1740-G-H

APH-1740-G-H

Samtec Inc.

4,219
APH-1740-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
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