IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 制造商型号 库存情况 价格 数量 数据手册 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APH-0938-G-H

APH-0938-G-H

APH-0938-G-H

Samtec Inc.

3,128
APH-0938-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1738-G-H

APH-1738-G-H

APH-1738-G-H

Samtec Inc.

1,482
APH-1738-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0438-G-H

APH-0438-G-H

APH-0438-G-H

Samtec Inc.

1,028
APH-0438-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1138-G-H

APH-1138-G-H

APH-1138-G-H

Samtec Inc.

3,692
APH-1138-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
32-6556-41

32-6556-41

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,376
32-6556-41

数据手册

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
124-PGM13008-41

124-PGM13008-41

CONN SOCKET PGA GOLD

Aries Electronics

3,805
124-PGM13008-41

数据手册

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
24-6553-16

24-6553-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

2,899
24-6553-16

数据手册

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
36-6556-40

36-6556-40

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

2,078
36-6556-40

数据手册

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
APH-1440-G-T

APH-1440-G-T

APH-1440-G-T

Samtec Inc.

4,694
APH-1440-G-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1940-G-T

APH-1940-G-T

APH-1940-G-T

Samtec Inc.

4,236
APH-1940-G-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1540-G-T

APH-1540-G-T

APH-1540-G-T

Samtec Inc.

2,100
APH-1540-G-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1040-G-T

APH-1040-G-T

APH-1040-G-T

Samtec Inc.

4,794
APH-1040-G-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0240-G-T

APH-0240-G-T

APH-0240-G-T

Samtec Inc.

4,669
APH-0240-G-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0340-G-T

APH-0340-G-T

APH-0340-G-T

Samtec Inc.

3,962
APH-0340-G-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1240-G-T

APH-1240-G-T

APH-1240-G-T

Samtec Inc.

4,805
APH-1240-G-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1640-G-T

APH-1640-G-T

APH-1640-G-T

Samtec Inc.

3,138
APH-1640-G-T

数据手册

* - Active - - - - - - - - - - - - - - -
550-10-432M31-001166

550-10-432M31-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

4,278
550-10-432M31-001166

数据手册

550 Bulk Active BGA 432 (31 x 31) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
192-PGM17025-11

192-PGM17025-11

CONN SOCKET PGA GOLD

Aries Electronics

2,975
192-PGM17025-11

数据手册

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
546-87-463-19-101147

546-87-463-19-101147

CONN SOCKET PGA 463POS GOLD

Preci-Dip

1,042
546-87-463-19-101147

数据手册

546 Bulk Active PGA 463 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-299-20-001112

614-83-299-20-001112

CONN SOCKET PGA 299POS GOLD

Preci-Dip

3,284
614-83-299-20-001112

数据手册

614 Bulk Active PGA 299 (20 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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