IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 制造商型号 库存情况 价格 数量 数据手册 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APH-1438-G-H

APH-1438-G-H

APH-1438-G-H

Samtec Inc.

1,009
APH-1438-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0538-G-H

APH-0538-G-H

APH-0538-G-H

Samtec Inc.

1,229
APH-0538-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1938-G-H

APH-1938-G-H

APH-1938-G-H

Samtec Inc.

2,119
APH-1938-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1538-G-H

APH-1538-G-H

APH-1538-G-H

Samtec Inc.

1,909
APH-1538-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0838-G-H

APH-0838-G-H

APH-0838-G-H

Samtec Inc.

2,190
APH-0838-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1638-G-H

APH-1638-G-H

APH-1638-G-H

Samtec Inc.

4,222
APH-1638-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1238-G-H

APH-1238-G-H

APH-1238-G-H

Samtec Inc.

1,543
APH-1238-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0738-G-H

APH-0738-G-H

APH-0738-G-H

Samtec Inc.

2,046
APH-0738-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0238-G-H

APH-0238-G-H

APH-0238-G-H

Samtec Inc.

4,603
APH-0238-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0338-G-H

APH-0338-G-H

APH-0338-G-H

Samtec Inc.

3,876
APH-0338-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0638-G-H

APH-0638-G-H

APH-0638-G-H

Samtec Inc.

4,572
APH-0638-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
42-6570-11

42-6570-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

2,232
42-6570-11

数据手册

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-6573-11

42-6573-11

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

4,444
42-6573-11

数据手册

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
514-83-256M16-000148

514-83-256M16-000148

CONN SOCKET BGA 256POS GOLD

Preci-Dip

2,524
514-83-256M16-000148

数据手册

514 Bulk Active BGA 256 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
514-83-256M20-001148

514-83-256M20-001148

CONN SOCKET BGA 256POS GOLD

Preci-Dip

2,287
514-83-256M20-001148

数据手册

514 Bulk Active BGA 256 (20 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-299-20-001112

614-87-299-20-001112

CONN SOCKET PGA 299POS GOLD

Preci-Dip

2,867
614-87-299-20-001112

数据手册

614 Bulk Active PGA 299 (20 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-91-209-17-081003

510-91-209-17-081003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,473
510-91-209-17-081003

数据手册

510 Bulk Active PGA 209 (17 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
120-PGM13015-40

120-PGM13015-40

CONN SOCKET PGA GOLD

Aries Electronics

2,764
120-PGM13015-40

数据手册

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
614-83-238-19-101112

614-83-238-19-101112

CONN SOCKET PGA 238POS GOLD

Preci-Dip

1,402
614-83-238-19-101112

数据手册

614 Bulk Active PGA 238 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
133-PGM14014-40

133-PGM14014-40

CONN SOCKET PGA GOLD

Aries Electronics

1,720
133-PGM14014-40

数据手册

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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