IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 制造商型号 库存情况 价格 数量 数据手册 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APH-0238-G-T

APH-0238-G-T

APH-0238-G-T

Samtec Inc.

1,352
APH-0238-G-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0638-G-T

APH-0638-G-T

APH-0638-G-T

Samtec Inc.

1,701
APH-0638-G-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1138-G-T

APH-1138-G-T

APH-1138-G-T

Samtec Inc.

3,448
APH-1138-G-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0338-G-T

APH-0338-G-T

APH-0338-G-T

Samtec Inc.

3,137
APH-0338-G-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0738-G-T

APH-0738-G-T

APH-0738-G-T

Samtec Inc.

4,344
APH-0738-G-T

数据手册

* - Active - - - - - - - - - - - - - - -
50-9503-21

50-9503-21

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

3,307
50-9503-21

数据手册

503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
50-9503-31

50-9503-31

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

2,504
50-9503-31

数据手册

503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
510-93-149-15-061003

510-93-149-15-061003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

1,598
510-93-149-15-061003

数据手册

510 Bulk Active PGA 149 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-43-630-10-002000

299-43-630-10-002000

CONN IC DIP SOCKET 30POS GOLD

Mill-Max Manufacturing Corp.

1,030
299-43-630-10-002000

数据手册

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1828-G-R

APH-1828-G-R

APH-1828-G-R

Samtec Inc.

3,479
APH-1828-G-R

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0928-G-R

APH-0928-G-R

APH-0928-G-R

Samtec Inc.

3,604
APH-0928-G-R

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1928-G-R

APH-1928-G-R

APH-1928-G-R

Samtec Inc.

2,580
APH-1928-G-R

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1028-G-R

APH-1028-G-R

APH-1028-G-R

Samtec Inc.

1,091
APH-1028-G-R

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1628-G-R

APH-1628-G-R

APH-1628-G-R

Samtec Inc.

4,714
APH-1628-G-R

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1728-G-R

APH-1728-G-R

APH-1728-G-R

Samtec Inc.

3,298
APH-1728-G-R

数据手册

* - Active - - - - - - - - - - - - - - -
48-3574-11

48-3574-11

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

1,349
48-3574-11

数据手册

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
HLS-0513-G-38

HLS-0513-G-38

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

3,853
HLS-0513-G-38

数据手册

HLS Bulk Active SIP 65 (5 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
510-13-089-12-051001

510-13-089-12-051001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,217
510-13-089-12-051001

数据手册

510 Bulk Active PGA 89 (12 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-93-153-15-061001

510-93-153-15-061001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,525
510-93-153-15-061001

数据手册

510 Bulk Active PGA 153 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-13-640-61-801000

110-13-640-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,977
110-13-640-61-801000

数据手册

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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