上传BOM单
IC 插座
| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
A-CCS068-Z-SM/TSOCKET Assmann WSW Components |
4,044 |
|
数据手册 |
- | Bulk | Active | PLCC | 68 | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | - | - | - | Polyphenylene Sulfide (PPS), Glass Filled | -40°C ~ 105°C |
|
|
AJ 64-LCSOCKET Assmann WSW Components |
1,416 |
|
数据手册 |
- | Bulk | Active | DIP, 0.75" (19.05mm) Row Spacing | 64 (2 x 32) | 0.070" (1.78mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) | -55°C ~ 85°C |
|
|
ARO 64-HZL/NEC-TSOCKET Assmann WSW Components |
3,222 |
|
数据手册 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
AR24-HZL/7/07-TTCONN IC DIP SOCKET 24POS GOLD Assmann WSW Components |
4,088 |
|
数据手册 |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
|
|
A-ICS-254-08-TT50IC SOCKET, MACHINED PIN, 7.62MM, Assmann WSW Components |
3,674 |
|
数据手册 |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 | 0.100" (2.54mm) | Nickel | 78.7µin (2.00µm) | Beryllium Copper | Through Hole, Right Angle | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
|
AR 32 HGL-TTSOCKET Assmann WSW Components |
4,019 |
|
数据手册 |
AR | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 32 | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
|
A-CCS 028-Z-SM/TIC SOCKET, CHIP CARRIER, 1.27MM, Assmann WSW Components |
4,959 |
|
数据手册 |
- | Tape & Reel (TR) | Active | PLCC | 28 | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Polyphenylene Sulfide (PPS), Glass Filled | -40°C ~ 105°C |
|
|
AR28-HZL/01-TTCONN IC DIP SOCKET 28POS GOLD Assmann WSW Components |
3,389 |
|
数据手册 |
- | Bag | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
|
A-CCS84-Z-RCONN SOCKET PLCC 84POS TIN Assmann WSW Components |
3,850 |
|
数据手册 |
- | Tube | Obsolete | PLCC | 84 (4 x 21) | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
|
A32-LCG-T-RCONN IC DIP SOCKET 32POS GOLD Assmann WSW Components |
1,612 |
|
数据手册 |
- | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | - | - | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | - | - | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
