上传BOM单
IC 插座
| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
AW 127-40/Z-TSOCKET 40 CONTACTS SINGLE ROW Assmann WSW Components |
3,931 |
|
数据手册 |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
A-CCS052-Z-SM/PSOCKET Assmann WSW Components |
4,534 |
|
数据手册 |
- | Bulk | Active | PLCC | 52 | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Polyphenylene Sulfide (PPS), Glass Filled | -40°C ~ 105°C |
|
|
AR 20-HZL/01-TTSOCKET Assmann WSW Components |
3,759 |
|
数据手册 |
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
|
A-CCS068-Z-SM/PSOCKET Assmann WSW Components |
3,920 |
|
数据手册 |
- | Bulk | Active | PLCC | 68 | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Polyphenylene Sulfide (PPS), Glass Filled | -40°C ~ 105°C |
|
|
AW127-20/Z-T-RSOCKET 20 CONTACTS SINGLE ROW Assmann WSW Components |
4,651 |
|
数据手册 |
- | Bulk | Obsolete | - | 20 (1 x 20) | 0.100" (2.54mm) | Nickel | 78.7µin (2.00µm) | Brass | Through Hole | - | Solder | 0.100" (2.54mm) | Nickel | 78.7µin (2.00µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -40°C ~ 105°C |
|
|
AR 24 HGL-TTSOCKET Assmann WSW Components |
4,903 |
|
数据手册 |
AR | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
|
AR 24 HGL/7-TTSOCKET Assmann WSW Components |
4,460 |
|
数据手册 |
AR | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
A22-LCG-T-RCONN IC DIP SOCKET 22POS GOLD Assmann WSW Components |
4,233 |
|
数据手册 |
- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | - | - | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | - | - | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
|
|
AJ 52-LCSOCKET Assmann WSW Components |
3,102 |
|
数据手册 |
- | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 52 (2 x 26) | 0.070" (1.78mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) | -55°C ~ 85°C |
|
A-CCS20-G-RCONN SOCKET PLCC 20POS GOLD Assmann WSW Components |
2,957 |
|
数据手册 |
- | Tube | Obsolete | PLCC | 20 (4 x 5) | 0.050" (1.27mm) | Gold | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
