上传BOM单
IC 插座
| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ED084PLCZ-SM-NCONN SOCKET PLCC 84POS On Shore Technology Inc. |
1,405 |
|
数据手册 |
ED | Tube | Active | PLCC | 84 (2x42) | 0.050" (1.27mm) | - | - | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | - | - | Phosphor Bronze | Polyphenylene Sulfide (PPS) | -55°C ~ 105°C |
|
BU-20OZCONN IC DIP SOCKET 20POS On Shore Technology Inc. |
1,910 |
|
数据手册 |
BU | Tube | Active | - | 20 (2 x 10) | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
BU160Z-178-HTCONN IC DIP SOCKET 16POS GOLD On Shore Technology Inc. |
3,128 |
|
数据手册 |
BU-178HT | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
ED068PLCZCONN SOCKET PLCC 68POS TIN On Shore Technology Inc. |
4,961 |
|
数据手册 |
ED | Tube | Active | PLCC | 68 (2 x 34) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) | -55°C ~ 105°C |
|
ED084PLCZCONN SOCKET PLCC 84POS TIN On Shore Technology Inc. |
4,460 |
|
数据手册 |
ED | Tube | Active | PLCC | 84 (2x42) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) | -55°C ~ 105°C |
|
BU14OZ-178-HTCONN IC DIP SOCKET 14POS GOLD On Shore Technology Inc. |
3,278 |
|
数据手册 |
BU-178HT | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
BU080Z-178-HTCONN IC DIP SOCKET 8POS GOLD On Shore Technology Inc. |
3,167 |
|
数据手册 |
BU-178HT | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
BU180Z-178-HTCONN IC DIP SOCKET 18POS GOLD On Shore Technology Inc. |
3,481 |
|
数据手册 |
BU-178HT | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
BU320ZCONN IC DIP SOCKET 32POS On Shore Technology Inc. |
4,014 |
|
数据手册 |
BU | - | Active | - | 32 (2 x 16) | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
SA649000CONN IC DIP SOCKET 64POS GOLD On Shore Technology Inc. |
3,902 |
|
数据手册 |
SA | Tube | Obsolete | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Thermoplastic, Polyester, Glass Filled | -40°C ~ 105°C |
