上传BOM单
IC 插座
| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ED28DTCONN IC DIP SOCKET 28POS TIN On Shore Technology Inc. |
7,399 |
|
数据手册 |
ED | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 110°C |
|
ED241DTCONN IC DIP SOCKET 24POS TIN On Shore Technology Inc. |
2,669 |
|
数据手册 |
ED | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 110°C |
|
ED16DTCONN IC DIP SOCKET 16POS TIN On Shore Technology Inc. |
4,120 |
|
数据手册 |
ED | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 110°C |
|
ED20DTCONN IC DIP SOCKET 20POS TIN On Shore Technology Inc. |
15,136 |
|
数据手册 |
ED | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 110°C |
|
SA083000CONN IC DIP SOCKET 8POS GOLD On Shore Technology Inc. |
4,096 |
|
数据手册 |
SA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Thermoplastic, Polyester, Glass Filled | -40°C ~ 105°C |
|
SA103000CONN IC DIP SOCKET 10POS GOLD On Shore Technology Inc. |
3,976 |
|
数据手册 |
SA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Thermoplastic, Polyester, Glass Filled | -40°C ~ 105°C |
|
SA183040CONN IC DIP SOCKET 18POS GOLD On Shore Technology Inc. |
411 |
|
数据手册 |
SA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 80.0µin (2.03µm) | Brass | Thermoplastic, Polyester, Glass Filled | -40°C ~ 105°C |
|
SA143040CONN IC DIP SOCKET 14POS GOLD On Shore Technology Inc. |
4,785 |
|
数据手册 |
SA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 80.0µin (2.03µm) | Brass | Thermoplastic, Polyester, Glass Filled | -40°C ~ 105°C |
|
SA203040CONN IC DIP SOCKET 20POS GOLD On Shore Technology Inc. |
1,012 |
|
数据手册 |
SA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 80.0µin (2.03µm) | Brass | Thermoplastic, Polyester, Glass Filled | -40°C ~ 105°C |
|
SA246040CONN IC DIP SOCKET 24POS GOLD On Shore Technology Inc. |
108 |
|
数据手册 |
SA | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 80.0µin (2.03µm) | Brass | Thermoplastic, Polyester, Glass Filled | -40°C ~ 105°C |
