| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 可编程 | 存储类型 | 存储格式 | 技术 | 存储容量 | 存储组织 | 存储接口 | 时钟频率 | 写周期时间 - 字,页 | 访问时间 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
W66CL2NQUAGI TRIC DRAM 4GBIT LVSTL 11 200WFBGA Winbond Electronics |
4,375 |
|
数据手册 |
- | 200-WFBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 4Gbit | 256M x 16 | LVSTL_11 | 2.133 GHz | 18ns | - | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 95°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |
|
W29N08GVSIAA TRIC FLASH 8GBIT PAR 48TSOP Winbond Electronics |
2,969 |
|
数据手册 |
- | 48-TFSOP (0.724", 18.40mm Width) | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 8Gbit | 1G x 8 | ONFI | - | 25ns, 700µs | 20 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 48-TSOP |
|
W29N08GVBIAA TRIC FLASH 8GBIT PAR 63VFBGA Winbond Electronics |
3,596 |
|
数据手册 |
- | 63-VFBGA | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 8Gbit | 1G x 8 | ONFI | - | 25ns, 700µs | 20 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 63-FBGA (11x9) |
|
W29N08GZSIBF TRIC FLASH 8GBIT PAR 48TSOP Winbond Electronics |
1,010 |
|
数据手册 |
- | 48-TFSOP (0.724", 18.40mm Width) | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 8Gbit | 1G x 8 | ONFI | - | 35ns, 700µs | 25 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 48-TSOP |
|
W29N08GZSIBA TRIC FLASH 8GBIT PAR 48TSOP Winbond Electronics |
1,748 |
|
数据手册 |
- | 48-TFSOP (0.724", 18.40mm Width) | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 8Gbit | 1G x 8 | ONFI | - | 35ns, 700µs | 25 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 48-TSOP |
|
W66CM2NQUAGI TRIC DRAM 4GBIT LVSTL 11 200WFBGA Winbond Electronics |
1,615 |
|
数据手册 |
- | 200-WFBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 4Gbit | 256M x 16 | LVSTL_11 | 1.866 GHz | 18ns | - | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 95°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |
|
W29N08GWBIBA TRIC FLASH 8GBIT PAR 63VFBGA Winbond Electronics |
1,203 |
|
数据手册 |
- | 63-VFBGA | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 8Gbit | 512M x 16 | ONFI | - | 35ns, 700µs | 25 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 63-VFBGA (9x11) |
|
W29N08GZBIBA TRIC FLASH 8GBIT PAR 63VFBGA Winbond Electronics |
4,515 |
|
数据手册 |
- | 63-VFBGA | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 8Gbit | 1G x 8 | ONFI | - | 35ns, 700µs | 25 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 63-VFBGA (9x11) |
|
W29N08GZBIBF TRIC FLASH 8GBIT PAR 63VFBGA Winbond Electronics |
1,968 |
|
数据手册 |
- | 63-VFBGA | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 8Gbit | 1G x 8 | ONFI | - | 35ns, 700µs | 25 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 63-VFBGA (9x11) |
|
W29N08GWBIBF TRIC FLASH 8GBIT PAR 63VFBGA Winbond Electronics |
3,293 |
|
数据手册 |
- | 63-VFBGA | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 8Gbit | 512M x 16 | ONFI | - | 35ns, 700µs | 25 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 63-VFBGA (9x11) |