| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 可编程 | 存储类型 | 存储格式 | 技术 | 存储容量 | 存储组织 | 存储接口 | 时钟频率 | 写周期时间 - 字,页 | 访问时间 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
W25N04KWTCIU TRIC FLASH 4GBIT SPI/QUAD 24TFBGA Winbond Electronics |
2,506 |
|
数据手册 |
SpiFlash® | 24-TBGA | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 4Gbit | 512M x 8 | SPI - Quad I/O | 104 MHz | 700µs | 8 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 24-TFBGA (8x6) |
|
W25N04KWTCIR TRIC FLASH 4GBIT SPI/QUAD 24TFBGA Winbond Electronics |
3,124 |
|
数据手册 |
SpiFlash® | 24-TBGA | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 4Gbit | 512M x 8 | SPI - Quad I/O | 104 MHz | 700µs | 8 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 24-TFBGA (8x6) |
|
W66BM6NBUAGJ TRIC DRAM 2GBIT LVSTL 11 200WFBGA Winbond Electronics |
2,582 |
|
数据手册 |
- | 200-WFBGA | Tape & Reel (TR) | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 2Gbit | 128M x 16 | LVSTL_11 | 1.866 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |
|
W25N04KWTBIR TRIC FLASH 4GBIT SPI/QUAD 24TFBGA Winbond Electronics |
3,160 |
|
数据手册 |
SpiFlash® | 24-TBGA | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 4Gbit | 512M x 8 | SPI - Quad I/O | 104 MHz | 700µs | 8 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 24-TFBGA (8x6) |
|
W25N04KWTBIU TRIC FLASH 4GBIT SPI/QUAD 24TFBGA Winbond Electronics |
4,566 |
|
数据手册 |
SpiFlash® | 24-TBGA | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 4Gbit | 512M x 8 | SPI - Quad I/O | 104 MHz | 700µs | 8 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 24-TFBGA (8x6) |
|
W35N02JWTBIC TRIC FLASH 2GBIT SPI/OCT 24TFBGA Winbond Electronics |
4,354 |
|
数据手册 |
- | 24-TBGA | Tape & Reel (TR) | Active | - | Non-Volatile | FLASH | FLASH - NAND (SLC) | 2Gbit | 256M x 8 | SPI - Octal I/O | 166 MHz | - | - | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 24-TFBGA (8x6) |
|
W35N02JWTBIF TRIC FLASH 2GBIT SPI/OCT 24TFBGA Winbond Electronics |
3,073 |
|
数据手册 |
- | 24-TBGA | Tape & Reel (TR) | Active | - | Non-Volatile | FLASH | FLASH - NAND (SLC) | 2Gbit | 256M x 8 | SPI - Octal I/O | 166 MHz | - | - | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 24-TFBGA (8x6) |
|
W632GG6NB12I TRIC DRAM 2GBIT SSTL 15 96VFBGA Winbond Electronics |
1,302 |
|
数据手册 |
- | 96-VFBGA | Tape & Reel (TR) | Last Time Buy | Not Verified | Volatile | DRAM | SDRAM - DDR3 | 2Gbit | 128M x 16 | SSTL_15 | 800 MHz | 15ns | 20 ns | 1.425V ~ 1.575V | -40°C ~ 95°C (TC) | - | - | Surface Mount | 96-VFBGA (7.5x13) |
|
W634GU6QB11IIC DRAM 4GBIT PAR 96VFBGA Winbond Electronics |
4,360 |
|
数据手册 |
- | 96-VFBGA | Tray | Obsolete | Not Verified | Volatile | DRAM | SDRAM - DDR3L | 4Gbit | 256M x 16 | Parallel | 933 MHz | 15ns | 20 ns | 1.283V ~ 1.45V | -40°C ~ 95°C (TC) | - | - | Surface Mount | 96-VFBGA (7.5x13) |
|
W634GU6QB09IIC DRAM 4GBIT PAR 96VFBGA Winbond Electronics |
4,880 |
|
数据手册 |
- | 96-VFBGA | Tray | Obsolete | Not Verified | Volatile | DRAM | SDRAM - DDR3L | 4Gbit | 256M x 16 | Parallel | 1.06 GHz | 15ns | 20 ns | 1.283V ~ 1.45V | -40°C ~ 95°C (TC) | - | - | Surface Mount | 96-VFBGA (7.5x13) |