| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 可编程 | 存储类型 | 存储格式 | 技术 | 存储容量 | 存储组织 | 存储接口 | 时钟频率 | 写周期时间 - 字,页 | 访问时间 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
W97BH6MBVA1EIC DRAM 2GBIT HSUL 12 134VFBGA Winbond Electronics |
4,322 |
|
数据手册 |
- | 134-VFBGA | Tray | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR2-S4B | 2Gbit | 128M x 16 | HSUL_12 | 533 MHz | 15ns | - | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -25°C ~ 85°C (TC) | - | - | Surface Mount | 134-VFBGA (10x11.5) |
|
W97BH2MBVA1IIC DRAM 2GBIT HSUL 12 134VFBGA Winbond Electronics |
2,966 |
|
数据手册 |
- | 134-VFBGA | Tray | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR2-S4B | 2Gbit | 64M x 32 | HSUL_12 | 533 MHz | 15ns | - | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -40°C ~ 85°C (TC) | - | - | Surface Mount | 134-VFBGA (10x11.5) |
|
W97BH2MBVA1EIC DRAM 2GBIT HSUL 12 134VFBGA Winbond Electronics |
4,863 |
|
数据手册 |
- | 134-VFBGA | Tray | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR2-S4B | 2Gbit | 64M x 32 | HSUL_12 | 533 MHz | 15ns | - | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -25°C ~ 85°C (TC) | - | - | Surface Mount | 134-VFBGA (10x11.5) |
|
W634GU8QB11IIC DRAM 4GBIT PAR 78VFBGA Winbond Electronics |
1,817 |
|
数据手册 |
- | 78-VFBGA | Tray | Obsolete | Not Verified | Volatile | DRAM | SDRAM - DDR3L | 4Gbit | 512M x 8 | Parallel | 933 MHz | 15ns | 20 ns | 1.283V ~ 1.45V | -40°C ~ 95°C (TC) | - | - | Surface Mount | 78-VFBGA (8x10.5) |
|
W25M512JWFIQ TRIC FLASH 512MBIT SPI 16SOIC Winbond Electronics |
1,720 |
|
数据手册 |
SpiFlash® | 16-SOIC (0.295", 7.50mm Width) | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 512Mbit | 64M x 8 | SPI | 104 MHz | 5ms | 7 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 16-SOIC |
|
W66BL6NBUAGJ TRIC DRAM 2GBIT LVSTL 11 200WFBGA Winbond Electronics |
1,082 |
|
数据手册 |
- | 200-WFBGA | Tape & Reel (TR) | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 2Gbit | 128M x 16 | LVSTL_11 | 1.866 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |
|
W634GU8QB09IIC DRAM 4GBIT PAR 78VFBGA Winbond Electronics |
4,336 |
|
数据手册 |
- | 78-VFBGA | Tray | Obsolete | Not Verified | Volatile | DRAM | SDRAM - DDR3L | 4Gbit | 512M x 8 | Parallel | 1.06 GHz | 15ns | 20 ns | 1.283V ~ 1.45V | -40°C ~ 95°C (TC) | - | - | Surface Mount | 78-VFBGA (8x10.5) |
|
W25M512JWBIQ TRIC FLASH 512MBIT SPI 24TFBGA Winbond Electronics |
4,173 |
|
数据手册 |
SpiFlash® | 24-TBGA | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 512Mbit | 64M x 8 | SPI | 104 MHz | 5ms | 7 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 24-TFBGA (6x8) |
|
W25Q512NWBIQIC FLASH 512MBIT SPI 24TFBGA Winbond Electronics |
2,256 |
|
数据手册 |
SpiFlash® | 24-TBGA | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 512Mbit | 64M x 8 | SPI - Quad I/O, QPI, DTR | 133 MHz | 3ms | 6 ns | 1.65V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 24-TFBGA (6x8) |
|
W25N04KVZEIUIC FLASH 4GBIT SPI/QUAD 8WSON Winbond Electronics |
2,945 |
|
数据手册 |
SpiFlash® | 8-WDFN Exposed Pad | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND | 4Gbit | 512M x 8 | SPI - Quad I/O | 104 MHz | 250µs | - | 2.7V ~ 3.6V | -40°C ~ 85°C | - | - | Surface Mount | 8-WSON (8x6) |