| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 可编程 | 存储类型 | 存储格式 | 技术 | 存储容量 | 存储组织 | 存储接口 | 时钟频率 | 写周期时间 - 字,页 | 访问时间 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
W97BH2MBVA1I TRIC DRAM 2GBIT HSUL 12 134VFBGA Winbond Electronics |
4,799 |
|
数据手册 |
- | 134-VFBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR2-S4B | 2Gbit | 64M x 32 | HSUL_12 | 533 MHz | 15ns | - | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -40°C ~ 85°C (TC) | - | - | Surface Mount | 134-VFBGA (10x11.5) |
|
W66CP2NQQAHJIC DRAM 4GBIT LVSTL 200TFBGA Winbond Electronics |
2,331 |
|
数据手册 |
- | 200-TFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 4Gbit | 128M x 32 | LVSTL_11 | 2.133 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-TFBGA (10x14.5) |
|
W66CQ2NQQAHJIC DRAM 4GBIT LVSTL 200TFBGA Winbond Electronics |
2,508 |
|
数据手册 |
- | 200-TFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 4Gbit | 128M x 32 | LVSTL_11 | 2.133 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-TFBGA (10x14.5) |
|
W634GU8QB-09IC DRAM 4GBIT PAR 78VFBGA Winbond Electronics |
1,080 |
|
数据手册 |
- | 78-VFBGA | Tray | Obsolete | Not Verified | Volatile | DRAM | SDRAM - DDR3L | 4Gbit | 512M x 8 | Parallel | 1.06 GHz | 15ns | 20 ns | 1.283V ~ 1.45V | 0°C ~ 95°C (TC) | - | - | Surface Mount | 78-VFBGA (8x10.5) |
|
W978H2KBVX2EIC DRAM 256MBIT PAR 134VFBGA Winbond Electronics |
4,578 |
|
数据手册 |
- | 134-VFBGA | Tray | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 256Mbit | 8M x 32 | Parallel | 400 MHz | 15ns | - | 1.14V ~ 1.95V | -25°C ~ 85°C (TC) | - | - | Surface Mount | 134-VFBGA (10x11.5) |
|
W978H2KBVX2IIC DRAM 256MBIT PAR 134VFBGA Winbond Electronics |
2,650 |
|
数据手册 |
- | 134-VFBGA | Tray | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 256Mbit | 8M x 32 | Parallel | 400 MHz | 15ns | - | 1.14V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 134-VFBGA (10x11.5) |
|
W978H6KBVX2EIC DRAM 256MBIT PAR 134VFBGA Winbond Electronics |
2,517 |
|
数据手册 |
- | 134-VFBGA | Tray | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 256Mbit | 16M x 16 | Parallel | 400 MHz | 15ns | - | 1.14V ~ 1.95V | -25°C ~ 85°C (TC) | - | - | Surface Mount | 134-VFBGA (10x11.5) |
|
W978H6KBVX1EIC DRAM 256MBIT HSUL 12 134VFBGA Winbond Electronics |
3,634 |
|
数据手册 |
- | 134-VFBGA | Tray | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR2-S4B | 256Mbit | 16M x 16 | HSUL_12 | 533 MHz | 15ns | 5.5 ns | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -25°C ~ 85°C (TC) | - | - | Surface Mount | 134-VFBGA (10x11.5) |
|
W978H2KBVX1IIC DRAM 256MBIT HSUL 12 134VFBGA Winbond Electronics |
1,622 |
|
数据手册 |
- | 134-VFBGA | Tray | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR2-S4B | 256Mbit | 8M x 32 | HSUL_12 | 533 MHz | 15ns | 5.5 ns | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -40°C ~ 85°C (TC) | - | - | Surface Mount | 134-VFBGA (10x11.5) |
|
W978H2KBVX1EIC DRAM 256MBIT HSUL 12 134VFBGA Winbond Electronics |
4,208 |
|
数据手册 |
- | 134-VFBGA | Tray | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR2-S4B | 256Mbit | 8M x 32 | HSUL_12 | 533 MHz | 15ns | 5.5 ns | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -25°C ~ 85°C (TC) | - | - | Surface Mount | 134-VFBGA (10x11.5) |