| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 可编程 | 存储类型 | 存储格式 | 技术 | 存储容量 | 存储组织 | 存储接口 | 时钟频率 | 写周期时间 - 字,页 | 访问时间 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
W25N02JWSFIF TRIC FLASH 2GBIT SPI/QUAD 16SOIC Winbond Electronics |
2,906 |
|
数据手册 |
SpiFlash® | 16-SOIC (0.295", 7.50mm Width) | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 2Gbit | 256M x 8 | SPI - Quad I/O, QPI, DTR | 166 MHz | 700µs | 6 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 16-SOIC |
|
W25N02JWSFIC TRIC FLASH 2GBIT SPI/QUAD 16SOIC Winbond Electronics |
2,570 |
|
数据手册 |
SpiFlash® | 16-SOIC (0.295", 7.50mm Width) | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 2Gbit | 256M x 8 | SPI - Quad I/O, QPI, DTR | 166 MHz | 700µs | 6 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 16-SOIC |
|
W66BQ2NQUAGJIC DRAM 2GBIT LVSTL 06 200WFBGA Winbond Electronics |
1,264 |
|
数据手册 |
- | 200-WFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 2Gbit | 64M x 32 | LVSTL_06 | 1.867 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |
|
W66BP2NQUAGJIC DRAM 2GBIT LVSTL 11 200TFBGA Winbond Electronics |
1,754 |
|
数据手册 |
- | 200-TFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 2Gbit | 64M x 32 | LVSTL_11 | 1.867 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-TFBGA (10x14.5) |
|
W25R512JVFINIC FLASH 512MBIT SPI 16SOIC Winbond Electronics |
2,830 |
|
数据手册 |
- | - | Tray | Active | - | - | FLASH | - | 512Mbit | 64M x 8 | SPI | 133 MHz | - | - | - | - | - | - | - | 16-SOIC |
|
W25R512JVFIQ TRIC FLASH 512MBIT SPI 16SOIC Winbond Electronics |
3,713 |
|
数据手册 |
- | 16-SOIC (0.295", 7.50mm Width) | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 512Mbit | 64M x 8 | SPI | 133 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C | - | - | Surface Mount | 16-SOIC |
|
W66BP2NQUAHJIC DRAM 2GBIT LVSTL 11 200TFBGA Winbond Electronics |
4,594 |
|
数据手册 |
- | 200-TFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 2Gbit | 64M x 32 | LVSTL_11 | 2.133 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-TFBGA (10x14.5) |
|
W66BQ2NQUAHJIC DRAM 2GBIT LVSTL 06 200WFBGA Winbond Electronics |
1,297 |
|
数据手册 |
- | 200-WFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 2Gbit | 64M x 32 | LVSTL_06 | 2.133 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |
|
W66CQ2NQUAFJ TRIC DRAM 4GBIT LVSTL 11 200WFBGA Winbond Electronics |
1,999 |
|
数据手册 |
- | 200-WFBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 4Gbit | 128M x 32 | LVSTL_11 | 1.6 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |
|
W66CP2NQUAFJ TRIC DRAM 4GBIT LVSTL 11 200WFBGA Winbond Electronics |
2,365 |
|
数据手册 |
- | 200-WFBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 4Gbit | 128M x 32 | LVSTL_11 | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |