| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 可编程 | 存储类型 | 存储格式 | 技术 | 存储容量 | 存储组织 | 存储接口 | 时钟频率 | 写周期时间 - 字,页 | 访问时间 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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W632GG6NB11IIC DRAM 2GBIT PAR 96VFBGA Winbond Electronics |
2,650 |
|
数据手册 |
- | 96-VFBGA | Tray | Last Time Buy | Not Verified | Volatile | DRAM | SDRAM - DDR3 | 2Gbit | 128M x 16 | Parallel | 933 MHz | 15ns | 20 ns | 1.425V ~ 1.575V | -40°C ~ 95°C (TC) | - | - | Surface Mount | 96-VFBGA (7.5x13) |
|
W66BP2NQQAHJIC DRAM 2GBIT LVSTL 11 200TFBGA Winbond Electronics |
1,126 |
|
数据手册 |
- | 200-TFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 2Gbit | 64M x 32 | LVSTL_11 | 2.133 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-TFBGA (10x14.5) |
|
W66BQ2NQQAHJIC DRAM 2GBIT LVSTL 06 200TFBGA Winbond Electronics |
1,982 |
|
数据手册 |
- | 200-TFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 2Gbit | 64M x 32 | LVSTL_06 | 2.133 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-TFBGA (10x14.5) |
|
W632GG8NB09IIC DRAM 2GBIT PAR 78VFBGA Winbond Electronics |
4,148 |
|
数据手册 |
- | 78-VFBGA | Tray | Last Time Buy | Not Verified | Volatile | DRAM | SDRAM - DDR3 | 2Gbit | 256M x 8 | Parallel | 1.067 GHz | 15ns | 20 ns | 1.425V ~ 1.575V | -40°C ~ 95°C (TC) | - | - | Surface Mount | 78-VFBGA (8x10.5) |
|
|
W632GG6NB09IIC DRAM 2GBIT PAR 96VFBGA Winbond Electronics |
1,345 |
|
数据手册 |
- | 96-VFBGA | Tray | Last Time Buy | Not Verified | Volatile | DRAM | SDRAM - DDR3 | 2Gbit | 128M x 16 | Parallel | 1.067 GHz | 15ns | 20 ns | 1.425V ~ 1.575V | -40°C ~ 95°C (TC) | - | - | Surface Mount | 96-VFBGA (7.5x13) |
|
W25Q512JVFIN TRIC FLASH 512MBIT SPI/QUAD 16SOIC Winbond Electronics |
2,880 |
|
数据手册 |
SpiFlash® | 16-SOIC (0.295", 7.50mm Width) | Tape & Reel (TR) | Active | - | Non-Volatile | FLASH | FLASH - NOR (SLC) | 512Mbit | 64M x 8 | SPI - Quad I/O, QPI | 133 MHz | 3.5ms | 6.5 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 16-SOIC |
|
W25Q512JVEIQ TRIC FLASH 512MBIT SPI/QUAD 8WSON Winbond Electronics |
2,390 |
|
数据手册 |
SpiFlash® | 8-WDFN Exposed Pad | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 512Mbit | 64M x 8 | SPI - Quad I/O | 133 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 8-WSON (8x6) |
|
W25Q512JVEIM TRIC FLASH 512MBIT SPI/QUAD 8WSON Winbond Electronics |
3,537 |
|
数据手册 |
SpiFlash® | 8-WDFN Exposed Pad | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 512Mbit | 64M x 8 | SPI - Quad I/O | 133 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 8-WSON (8x6) |
|
W66BQ2NQUAFJIC DRAM 2GBIT LVSTL 06 200WFBGA Winbond Electronics |
1,776 |
|
数据手册 |
- | 200-WFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 2Gbit | 64M x 32 | LVSTL_06 | 1.6 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |
|
W66BP2NQUAFJIC DRAM 2GBIT LVSTL 11 200TFBGA Winbond Electronics |
1,865 |
|
数据手册 |
- | 200-TFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 2Gbit | 64M x 32 | LVSTL_11 | 1.6 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-TFBGA (10x14.5) |