| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 可编程 | 存储类型 | 存储格式 | 技术 | 存储容量 | 存储组织 | 存储接口 | 时钟频率 | 写周期时间 - 字,页 | 访问时间 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
W978H2KBVX2I TRIC DRAM 256MBIT HSUL 12 134VFBGA Winbond Electronics |
3,616 |
|
数据手册 |
- | 134-VFBGA | Tape & Reel (TR) | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR2-S4B | 256Mbit | 8M x 32 | HSUL_12 | 400 MHz | 15ns | 5.5 ns | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -40°C ~ 85°C (TC) | - | - | Surface Mount | 134-VFBGA (10x11.5) |
|
W978H6KBVX2E TRIC DRAM 256MBIT HSUL 12 134VFBGA Winbond Electronics |
1,856 |
|
数据手册 |
- | 134-VFBGA | Tape & Reel (TR) | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR2-S4B | 256Mbit | 16M x 16 | HSUL_12 | 400 MHz | 15ns | 5.5 ns | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -25°C ~ 85°C (TC) | - | - | Surface Mount | 134-VFBGA (10x11.5) |
|
W978H2KBVX1E TRIC DRAM 256MBIT HSUL 12 134VFBGA Winbond Electronics |
1,432 |
|
数据手册 |
- | 134-VFBGA | Tape & Reel (TR) | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR2-S4B | 256Mbit | 8M x 32 | HSUL_12 | 533 MHz | 15ns | 5.5 ns | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -25°C ~ 85°C (TC) | - | - | Surface Mount | 134-VFBGA (10x11.5) |
|
W978H2KBVX2E TRIC DRAM 256MBIT HSUL 12 134VFBGA Winbond Electronics |
4,594 |
|
数据手册 |
- | 134-VFBGA | Tape & Reel (TR) | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR2-S4B | 256Mbit | 8M x 32 | HSUL_12 | 400 MHz | 15ns | 5.5 ns | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -25°C ~ 85°C (TC) | - | - | Surface Mount | 134-VFBGA (10x11.5) |
|
W978H6KBVX1E TRIC DRAM 256MBIT HSUL 12 134VFBGA Winbond Electronics |
1,674 |
|
数据手册 |
- | 134-VFBGA | Tape & Reel (TR) | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR2-S4B | 256Mbit | 16M x 16 | HSUL_12 | 533 MHz | 15ns | 5.5 ns | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -25°C ~ 85°C (TC) | - | - | Surface Mount | 134-VFBGA (10x11.5) |
|
W978H2KBVX1I TRIC DRAM 256MBIT HSUL 12 134VFBGA Winbond Electronics |
1,587 |
|
数据手册 |
- | 134-VFBGA | Tape & Reel (TR) | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR2-S4B | 256Mbit | 8M x 32 | HSUL_12 | 533 MHz | 15ns | 5.5 ns | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -40°C ~ 85°C (TC) | - | - | Surface Mount | 134-VFBGA (10x11.5) |
|
W9864G2JB-6IC DRAM 64MBIT 90-TFBG Winbond Electronics |
1,050 |
|
数据手册 |
- | 90-TFBGA | Tray | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM | 64Mbit | 2M x 32 | - | 166 MHz | - | 5 ns | 3V ~ 3.6V | 0°C ~ 70°C (TA) | - | - | Surface Mount | 90-TFBGA (8x13) |
|
W9864G2JB-6IIC DRAM 64MBIT 90-TFBGA Winbond Electronics |
3,367 |
|
数据手册 |
- | 90-TFBGA | Tray | Not For New Designs | Not Verified | Volatile | DRAM | SDRAM | 64Mbit | 2M x 32 | - | 166 MHz | - | 5 ns | 3V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 90-TFBGA (8x13) |
|
W63AH2NBVADIIC DRAM 1GBIT HSUL 12 178VFBGA Winbond Electronics |
1,906 |
|
数据手册 |
- | 178-VFBGA | Tray | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR3 | 1Gbit | 32M x 32 | HSUL_12 | 1.066 GHz | 15ns | 5.5 ns | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -40°C ~ 85°C (TC) | - | - | Surface Mount | 178-VFBGA (11x11.5) |
|
W66BQ2NQUAGJ TRIC DRAM 2GBIT LVSTL 06 200WFBGA Winbond Electronics |
3,739 |
|
数据手册 |
- | 200-WFBGA | Tape & Reel (TR) | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 2Gbit | 64M x 32 | LVSTL_06 | 1.867 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |