| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 可编程 | 存储类型 | 存储格式 | 技术 | 存储容量 | 存储组织 | 存储接口 | 时钟频率 | 写周期时间 - 字,页 | 访问时间 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
W632GG8NB11I TRIC DRAM 2GBIT SSTL 15 78VFBGA Winbond Electronics |
3,776 |
|
数据手册 |
- | 78-VFBGA | Tape & Reel (TR) | Last Time Buy | Not Verified | Volatile | DRAM | SDRAM - DDR3 | 2Gbit | 256M x 8 | SSTL_15 | 933 MHz | 15ns | 20 ns | 1.425V ~ 1.575V | -40°C ~ 95°C (TC) | - | - | Surface Mount | 78-VFBGA (8x10.5) |
|
W66BQ2NQQAGJ TRIC DRAM 2GBIT LVSTL 06 200TFBGA Winbond Electronics |
4,549 |
|
数据手册 |
- | 200-TFBGA | Tape & Reel (TR) | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 2Gbit | 64M x 32 | LVSTL_06 | 1.867 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-TFBGA (10x14.5) |
|
W66BP2NQQAGJ TRIC DRAM 2GBIT LVSTL 11 200TFBGA Winbond Electronics |
4,421 |
|
数据手册 |
- | 200-TFBGA | Tape & Reel (TR) | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 2Gbit | 64M x 32 | LVSTL_11 | 1.867 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-TFBGA (10x14.5) |
|
W66BP6NBUAGJIC DRAM 2GBIT LVSTL 11 200WFBGA Winbond Electronics |
3,755 |
|
数据手册 |
- | 200-WFBGA | Tray | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 2Gbit | 128M x 16 | LVSTL_11 | 1.866 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |
|
W66BQ6NBUAGJIC DRAM 2GBIT LVSTL 11 200WFBGA Winbond Electronics |
4,012 |
|
数据手册 |
- | 200-WFBGA | Tray | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 2Gbit | 128M x 16 | LVSTL_11 | 1.866 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |
|
W632GU8NB15IIC DRAM 2GBIT PAR 78VFBGA Winbond Electronics |
1,219 |
|
数据手册 |
- | 78-VFBGA | Tray | Last Time Buy | Not Verified | Volatile | DRAM | SDRAM - DDR3L | 2Gbit | 256M x 8 | Parallel | 667 MHz | 15ns | 20 ns | 1.283V ~ 1.45V | -40°C ~ 95°C (TC) | - | - | Surface Mount | 78-VFBGA (8x10.5) |
|
W66BP2NQQAHJ TRIC DRAM 2GBIT LVSTL 11 200TFBGA Winbond Electronics |
1,604 |
|
数据手册 |
- | 200-TFBGA | Tape & Reel (TR) | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 2Gbit | 64M x 32 | LVSTL_11 | 2.133 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-TFBGA (10x14.5) |
|
W66BQ2NQQAHJ TRIC DRAM 2GBIT LVSTL 06 200TFBGA Winbond Electronics |
3,561 |
|
数据手册 |
- | 200-TFBGA | Tape & Reel (TR) | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 2Gbit | 64M x 32 | LVSTL_06 | 2.133 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-TFBGA (10x14.5) |
|
W63AH2NBVABIIC DRAM 1GBIT HSUL 12 178VFBGA Winbond Electronics |
3,992 |
|
数据手册 |
- | 178-VFBGA | Tray | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR3 | 1Gbit | 32M x 32 | HSUL_12 | 800 MHz | 15ns | 5.5 ns | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -40°C ~ 85°C (TC) | - | - | Surface Mount | 178-VFBGA (11x11.5) |
|
W25N02KWZEIUIC FLASH 2GBIT SPI/QUAD 8WSON Winbond Electronics |
4,279 |
|
数据手册 |
SpiFlash® | 8-WDFN Exposed Pad | Tube | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 2Gbit | 256M x 8 | SPI - Quad I/O | 104 MHz | 700µs | 8 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 8-WSON (8x6) |