系统级芯片(SoC)

制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 闪存大小 RAM 大小 外设 连接性 速度 主要属性 工作温度 等级 认证 供应商设备封装

















































































































































































































































































































































































































































































































































































































































































































































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结果
图片 制造商型号 库存情况 价格 数量 数据手册 系列 封装/外壳 包装 产品状态 架构 核心处理器 闪存大小 RAM 大小 外设 连接性 速度 主要属性 工作温度 等级 认证 供应商设备封装
XCZU19EG-1FFVC1760E

XCZU19EG-1FFVC1760E

IC SOC CORTEX-A53 1760FCBGA

AMD

4,187
XCZU19EG-1FFVC1760E

数据手册

Zynq® UltraScale+™ MPSoC EG 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells 0°C ~ 100°C (TJ) - - 1760-FCBGA (42.5x42.5)
XCZU11EG-1FFVC1760I

XCZU11EG-1FFVC1760I

IC SOC CORTEX-A53 1760FCBGA

AMD

4,737
XCZU11EG-1FFVC1760I

数据手册

Zynq® UltraScale+™ MPSoC EG 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 653K+ Logic Cells -40°C ~ 100°C (TJ) - - 1760-FCBGA (42.5x42.5)
XCZU17EG-1FFVD1760E

XCZU17EG-1FFVD1760E

IC SOC CORTEX-A53 1760FCBGA

AMD

3,415
XCZU17EG-1FFVD1760E

数据手册

Zynq® UltraScale+™ MPSoC EG 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 926K+ Logic Cells 0°C ~ 100°C (TJ) - - 1760-FCBGA (42.5x42.5)
XCVM1302-2MLIVFVC1596

XCVM1302-2MLIVFVC1596

IC VERSALPRIME ACAP FPGA 1596BGA

AMD

1,701
XCVM1302-2MLIVFVC1596

数据手册

Versal™ Prime 1596-BFBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.4GHz Versal™ Prime FPGA, 70k Logic Cells -40°C ~ 100°C (TJ) - - 1596-BGA (37.5x37.5)
XCVM1302-2HSIVFVC1596

XCVM1302-2HSIVFVC1596

IC VERSALPRIME ACAP FPGA 1596BGA

AMD

1,258
XCVM1302-2HSIVFVC1596

数据手册

Versal™ Prime 1596-BFBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 800MHz, 1.65GHz Versal™ Prime FPGA, 70k Logic Cells -40°C ~ 100°C (TJ) - - 1596-BGA (37.5x37.5)
XCZU11EG-2FFVC1156I

XCZU11EG-2FFVC1156I

IC SOC CORTEX-A53 1156FCBGA

AMD

3,545
XCZU11EG-2FFVC1156I

数据手册

Zynq® UltraScale+™ MPSoC EG 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 653K+ Logic Cells -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU11EG-L2FFVC1156E

XCZU11EG-L2FFVC1156E

IC SOC CORTEX-A53 1156FCBGA

AMD

4,980
XCZU11EG-L2FFVC1156E

数据手册

Zynq® UltraScale+™ MPSoC EG 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 653K+ Logic Cells 0°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCVM1302-2LLEVSVD1760

XCVM1302-2LLEVSVD1760

IC VERSALPRIME ACAP FPGA 1760BGA

AMD

1,268
XCVM1302-2LLEVSVD1760

数据手册

Versal™ Prime 1760-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 450MHz, 1.08GHz Versal™ Prime FPGA, 70k Logic Cells 0°C ~ 100°C (TJ) - - 1760-FCBGA (40x40)
XCVM1302-1LLIVSVD1760

XCVM1302-1LLIVSVD1760

IC VERSALPRIME ACAP FPGA 1760BGA

AMD

2,398
XCVM1302-1LLIVSVD1760

数据手册

Versal™ Prime 1760-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 400MHz, 1GHz Versal™ Prime FPGA, 70k Logic Cells -40°C ~ 100°C (TJ) - - 1760-FCBGA (40x40)
XCVM1402-1LSENSVF1369

XCVM1402-1LSENSVF1369

IC VERSALPRIME ACAP FPGA 1369BGA

AMD

4,193
XCVM1402-1LSENSVF1369

数据手册

Versal™ Prime 1369-BFBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 400MHz, 1GHz Versal™ Prime FPGA, 1.2M Logic Cells 0°C ~ 100°C (TJ) - - 1369-BGA (35x35)
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