系统级芯片(SoC)

制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 闪存大小 RAM 大小 外设 连接性 速度 主要属性 工作温度 等级 认证 供应商设备封装

















































































































































































































































































































































































































































































































































































































































































































































全部应用
全部重置
结果
图片 制造商型号 库存情况 价格 数量 数据手册 系列 封装/外壳 包装 产品状态 架构 核心处理器 闪存大小 RAM 大小 外设 连接性 速度 主要属性 工作温度 等级 认证 供应商设备封装
XCZU7EV-3FBVB900E

XCZU7EV-3FBVB900E

IC SOC CORTEX-A53 900FCBGA

AMD

2,929
XCZU7EV-3FBVB900E

数据手册

Zynq® UltraScale+™ MPSoC EV 900-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.5GHz Zynq®UltraScale+™ FPGA, 504K+ Logic Cells 0°C ~ 100°C (TJ) - - 900-FCBGA (31x31)
XCZU9EG-L2FFVB1156E

XCZU9EG-L2FFVB1156E

IC SOC CORTEX-A53 1156FCBGA

AMD

2,776
XCZU9EG-L2FFVB1156E

数据手册

Zynq® UltraScale+™ MPSoC EG 1156-BBGA, FCBGA Bulk Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 599K+ Logic Cells 0°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCVM1302-2MSIVSVD1760

XCVM1302-2MSIVSVD1760

IC VERSALPRIME ACAP FPGA 1760BGA

AMD

2,416
XCVM1302-2MSIVSVD1760

数据手册

Versal™ Prime 1760-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.4GHz Versal™ Prime FPGA, 70k Logic Cells -40°C ~ 100°C (TJ) - - 1760-FCBGA (40x40)
XAZU11EG-1FFVF1517I

XAZU11EG-1FFVF1517I

IC ZUS MPSOC FPGA 1517FCBGA

AMD

4,997
XAZU11EG-1FFVF1517I

数据手册

Zynq® UltraScale+™ MPSoC EG 1517-BBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 192K+ Logic Cells -40°C ~ 100°C (TJ) - - 1517-FCBGA (40x40)
XCZU11EG-2FFVC1156E

XCZU11EG-2FFVC1156E

IC SOC CORTEX-A53 1156FCBGA

AMD

1,836
XCZU11EG-2FFVC1156E

数据手册

Zynq® UltraScale+™ MPSoC EG 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 653K+ Logic Cells 0°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU11EG-L1FFVC1156I

XCZU11EG-L1FFVC1156I

IC SOC CORTEX-A53 1156FCBGA

AMD

2,250
XCZU11EG-L1FFVC1156I

数据手册

Zynq® UltraScale+™ MPSoC EG 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 653K+ Logic Cells -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU17EG-1FFVC1760E

XCZU17EG-1FFVC1760E

IC SOC CORTEX-A53 1760FCBGA

AMD

4,603
XCZU17EG-1FFVC1760E

数据手册

Zynq® UltraScale+™ MPSoC EG 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 926K+ Logic Cells 0°C ~ 100°C (TJ) - - 1760-FCBGA (42.5x42.5)
XCVM1302-2LLENBVB1024

XCVM1302-2LLENBVB1024

IC VERSALPRIME ACAP FPGA 1024BGA

AMD

3,492
XCVM1302-2LLENBVB1024

数据手册

Versal™ Prime 1024-BFBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 450MHz, 1.08GHz Versal™ Prime FPGA, 70k Logic Cells 0°C ~ 100°C (TJ) - - 1024-BGA (31x31)
XCVM1302-1LLINBVB1024

XCVM1302-1LLINBVB1024

IC VERSALPRIME ACAP FPGA 1024BGA

AMD

1,158
XCVM1302-1LLINBVB1024

数据手册

Versal™ Prime 1024-BFBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 400MHz, 1GHz Versal™ Prime FPGA, 70k Logic Cells -40°C ~ 100°C (TJ) - - 1024-BGA (31x31)
XCVM1402-1MSEVSVD1760

XCVM1402-1MSEVSVD1760

IC VERSALPRIME ACAP FPGA 1760BGA

AMD

3,540
XCVM1402-1MSEVSVD1760

数据手册

Versal™ Prime 1760-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.3GHz Versal™ Prime FPGA, 1.2M Logic Cells 0°C ~ 100°C (TJ) - - 1760-FCBGA (40x40)
共 1129 条记录«上一页1... 4950515253545556...113下一页»
Search

搜索

OEM STOCK

产品

OEM STOCK

电话

OEM STOCK

用户