现场可编程门阵列(FPGA)

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部应用
全部重置
结果
图片 制造商型号 库存情况 价格 数量 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
AFS090-2QNG180

AFS090-2QNG180

IC FPGA 60 I/O 180QFN

Microsemi Corporation

1,856
AFS090-2QNG180

数据手册

Fusion® 180-WFQFN Dual Rows, Exposed Pad Tray Obsolete Not Verified - - 27648 60 90000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 180-QFN (10x10)
AGL400V2-FG144

AGL400V2-FG144

IC FPGA 97 I/O 144FBGA

Microsemi Corporation

1,896
AGL400V2-FG144

数据手册

IGLOO 144-LBGA Tray Obsolete Not Verified - 9216 55296 97 400000 1.14V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 144-FPBGA (13x13)
A3P400-FGG484

A3P400-FGG484

IC FPGA 194 I/O 484FBGA

Microsemi Corporation

3,886
A3P400-FGG484

数据手册

ProASIC3 484-BGA Tray Obsolete Not Verified - - 55296 194 400000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M1A3P400-FG484

M1A3P400-FG484

IC FPGA 194 I/O 484FBGA

Microsemi Corporation

1,782
M1A3P400-FG484

数据手册

ProASIC3 484-BGA Tray Obsolete Not Verified - - 55296 194 400000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M1A3P400-FGG484

M1A3P400-FGG484

IC FPGA 194 I/O 484FBGA

Microsemi Corporation

4,250
M1A3P400-FGG484

数据手册

ProASIC3 484-BGA Tray Obsolete Not Verified - - 55296 194 400000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A3P400-FG484

A3P400-FG484

IC FPGA 194 I/O 484FBGA

Microsemi Corporation

2,908
A3P400-FG484

数据手册

ProASIC3 484-BGA Tray Obsolete Not Verified - - 55296 194 400000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A3P250L-1FG256

A3P250L-1FG256

IC FPGA 157 I/O 256FBGA

Microsemi Corporation

4,101
A3P250L-1FG256

数据手册

ProASIC3L 256-LBGA Tray Obsolete Not Verified - - 36864 157 250000 1.14V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
A3P250L-1FGG256

A3P250L-1FGG256

IC FPGA 157 I/O 256FBGA

Microsemi Corporation

2,114
A3P250L-1FGG256

数据手册

ProASIC3L 256-LBGA Tray Obsolete Not Verified - - 36864 157 250000 1.14V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
AGL400V5-FGG144I

AGL400V5-FGG144I

IC FPGA 97 I/O 144FBGA

Microsemi Corporation

2,591
AGL400V5-FGG144I

数据手册

IGLOO 144-LBGA Tray Obsolete Not Verified - 9216 55296 97 400000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 144-FPBGA (13x13)
AGL400V5-FG144I

AGL400V5-FG144I

IC FPGA 97 I/O 144FBGA

Microsemi Corporation

1,139
AGL400V5-FG144I

数据手册

IGLOO 144-LBGA Tray Obsolete Not Verified - 9216 55296 97 400000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 144-FPBGA (13x13)
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