| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 包装 | 产品状态 | 类型 | 冷却封装 | 附件方式 | 形状 | 长度 | 宽度 | 直径 | Fin 高度 | 功耗 @ 温升 | 热阻 @ 强制气流 | 热阻 @ 自然对流 | 材质 | 材料表面处理 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
533566B42552G533566B42552G Boyd Laconia, LLC |
1,200 |
|
数据手册 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
581102B00000W/2 041476 PINSG581102B00000W/2 041476 PINSG Boyd Laconia, LLC |
2,099 |
|
数据手册 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
335224B00032G335224B00032G Boyd Laconia, LLC |
1,898 |
|
数据手册 |
- | Bulk | Active | Top Mount | BGA | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 0.984" (25.00mm) | 0.985" (25.00mm) | - | 0.390" (9.91mm) | 1.5W @ 50°C | 10.40°C/W @ 200 LFM | 34.00°C/W | Aluminum | Black Anodized |
|
342948-COPPER SKIVFIN342948,REV03(GP) Boyd Laconia, LLC |
2,193 |
|
数据手册 |
- | Bulk | Active | Board Level | BGA, FPGA | Push Pin, Thermal Material | Rectangular, Fins | 2.717" (69.00mm) | 2.756" (70.00mm) | - | 0.551" (14.00mm) | - | - | - | Copper | - |
|
2321B-TACHGTHM,2321B-TACHG Boyd Laconia, LLC |
4,270 |
|
数据手册 |
- | Bulk | Active | Top Mount | BGA | Bolt On | Rectangular, Pin Fins | 1.701" (43.20mm) | 1.626" (41.30mm) | - | 0.350" (8.89mm) | - | 6.93°C/W @ 200 LFM | 22.10°C/W | Aluminum | Black Anodized |
|
7021B-8223-CL03GTHM,7021B-8223-CL03G Boyd Laconia, LLC |
1,774 |
|
数据手册 |
- | Bulk | Active | Board Level, Vertical | TO-218, TO-220 | Bolt On and PC Pin | Rectangular, Fins | 1.750" (44.45mm) | 0.360" (9.14mm) | - | 1.450" (36.83mm) | 6.0W @ 50°C | 4.00°C/W @ 300 LFM | 6.80°C/W | Aluminum | Black Anodized |
|
10-BRD1-03G10-BRD1-03G Boyd Laconia, LLC |
3,061 |
|
数据手册 |
- | Bulk | Active | Top Mount | BGA | Solder Anchor | Square, Pin Fins | 1.476" (37.50mm) | 1.476" (37.50mm) | - | 0.905" (23.00mm) | - | 3.83°C/W @ 200 LFM | 10.10°C/W | Aluminum | Black Anodized |
|
374524B00023G306219 WITHOUT PAD,REV 00,00,04 Boyd Laconia, LLC |
4,983 |
|
数据手册 |
- | Bulk | Active | Top Mount | BGA, FPGA | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 1.063" (27.00mm) | 1.063" (27.00mm) | - | 0.984" (25.00mm) | 1.0W @ 20°C | 5.00°C/W @ 250 LFM | - | Aluminum | Black Anodized |
|
EH-160-H245GEH-160-H245, FG(GP) Boyd Laconia, LLC |
2,733 |
|
数据手册 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
KU-SBK-0381-ES-ST-0,3MM-SGKU-SBK-0381-ES-ST-0,3MM-SG Boyd Laconia, LLC |
1,716 |
|
数据手册 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |