| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 包装 | 产品状态 | 类型 | 冷却封装 | 附件方式 | 形状 | 长度 | 宽度 | 直径 | Fin 高度 | 功耗 @ 温升 | 热阻 @ 强制气流 | 热阻 @ 自然对流 | 材质 | 材料表面处理 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
7129DGBOARD LEVEL HEAT SINK Boyd Laconia, LLC |
4,159 |
|
数据手册 |
- | Bulk | Active | Board Level | TO-220 | Clip | Rectangular, Fins | 1.040" (26.42mm) | 0.866" (22.00mm) | - | 0.375" (9.52mm) | 3.5W @ 70°C | 7.00°C/W @ 500 LFM | 19.20°C/W | Copper | Tin |
|
374424B60023G374424B60023G Boyd Laconia, LLC |
3,104 |
|
数据手册 |
- | Bulk | Active | Top Mount | BGA, FPGA | Solder Anchor | Square, Pin Fins | 1.063" (27.00mm) | 1.063" (27.00mm) | - | 0.709" (18.00mm) | 3.0W @ 50°C | 6.50°C/W @ 200 LFM | 20.30°C/W | Aluminum | Black Anodized |
|
580200W00000GBOARD LEVEL HEAT SINK Boyd Laconia, LLC |
2,045 |
|
数据手册 |
- | Bulk | Active | Top Mount | 14-DIP and 16-DIP | Press Fit and PC Pin | Rectangular, Fins | 0.890" (22.61mm) | 0.600" (15.24mm) | - | 0.410" (10.42mm) | 1.0W @ 20°C | 12.00°C/W @ 200 LFM | 20.00°C/W | Aluminum | Black Anodized |
|
SW25-2GTHM,ZA3286 REV 6 SW25-2G Boyd Laconia, LLC |
2,038 |
|
数据手册 |
- | Bulk | Active | Board Level, Vertical | TO-218, TO-220, TO-247 | Bolt On and PC Pin | Rectangular, Fins | 0.984" (25.00mm) | 1.359" (34.50mm) | - | 0.492" (12.50mm) | 2.0W @ 30°C | 6.00°C/W @ 400 LFM | 13.00°C/W | Aluminum | Black Anodized |
|
KU-0334-AL-ST-1,2MM-2-A-VE/VZ-KU-0334-AL-ST-1,2MM-2-A-VE/VZ- Boyd Laconia, LLC |
3,282 |
|
数据手册 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
TV58GTHM,ZA2102 ISS 4 TV-58G Boyd Laconia, LLC |
3,185 |
|
数据手册 |
- | Bulk | Active | Board Level | TO-220 | Bolt On | Rectangular, Fins | 0.887" (22.53mm) | 0.749" (19.03mm) | - | 0.433" (11.00mm) | 1.5W @ 50°C | 14.00°C/W @ 400 LFM | 30.00°C/W | Aluminum | Black Anodized |
|
241804B91200G241804B91200G Boyd Laconia, LLC |
2,979 |
|
数据手册 |
- | Bulk | Active | Top Mount | Eighth Brick DC/DC Converter | Bolt On | Rectangular, Fins | 2.280" (57.90mm) | 0.902" (22.90mm) | - | 0.449" (11.40mm) | - | 3.00°C/W @ 500 LFM | 5.50°C/W | - | - |
|
325705R00000GBOARD LEVEL HEAT SINK Boyd Laconia, LLC |
4,344 |
|
数据手册 |
- | Bulk | Active | Board Level | TO-5 | Press Fit | Cylindrical | - | - | 0.318" (8.07mm) ID, 0.500" (12.70mm) OD | 0.250" (6.35mm) | 1.0W @ 60°C | 35.00°C/W @ 200 LFM | 60.00°C/W | Aluminum | Red Anodized |
|
10-5607-04G10-5607-04G Boyd Laconia, LLC |
3,780 |
|
数据手册 |
- | Bulk | Active | Board Level | BGA, FPGA | Push Pin, Thermal Material | Square, Fins | 1.470" (37.34mm) | 1.470" (37.34mm) | - | 0.390" (9.91mm) | 3.0W @ 70°C | 7.00°C/W @ 200 LFM | 22.10°C/W | Aluminum | Black Anodized |
|
|
576203B00000GBOARD LEVEL HEAT SINK Boyd Laconia, LLC |
4,872 |
|
数据手册 |
- | Bulk | Active | Board Level | TO-3 | Bolt On | Square, Pin Fins | 1.810" (45.97mm) | 1.810" (45.97mm) | - | 0.750" (19.05mm) | 4.0W @ 30°C | 2.50°C/W @ 400 LFM | 6.20°C/W | Aluminum | Black Anodized |