电子元器件供应链解决方案商
上传BOM单
散热器
| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 包装 | 产品状态 | 类型 | 冷却封装 | 附件方式 | 形状 | 长度 | 宽度 | 直径 | Fin 高度 | 功耗 @ 温升 | 热阻 @ 强制气流 | 热阻 @ 自然对流 | 材质 | 材料表面处理 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
HSB18-232310HEAT SINK, BGA, 23 X 23 X 10 MM Same Sky (Formerly CUI Devices) |
4,224 |
|
数据手册 |
HSB | Box | Active | Top Mount | BGA | Adhesive (Not Included) | Square, Pin Fins | 0.906" (23.00mm) | 0.906" (23.00mm) | - | 0.394" (10.00mm) | 3.7W @ 75°C | 6.80°C/W @ 200 LFM | 20.41°C/W | Aluminum Alloy | Black Anodized |
|
HSE-B20250-040H-01HEAT SINK, EXTRUSION, TO-220, 25 Same Sky (Formerly CUI Devices) |
1,145 |
|
数据手册 |
HSE | Box | Active | Board Level, Vertical | TO-220 | PC Pin | Rectangular, Angled Fins | 0.984" (25.00mm) | 1.359" (34.50mm) | - | 0.492" (12.50mm) | 5.5W @ 75°C | 4.44°C/W @ 200 LFM | 13.64°C/W | Aluminum Alloy | Black Anodized |
|
HSB08-212106HEAT SINK, BGA, 21 X 21 X 6 MM Same Sky (Formerly CUI Devices) |
1,436 |
|
数据手册 |
HSB | Box | Active | Top Mount | BGA | Adhesive (Not Included) | Square, Pin Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | - | 0.236" (6.00mm) | 3.0W @ 75°C | 9.70°C/W @ 200 LFM | 25.40°C/W | Aluminum Alloy | Black Anodized |
|
HSB12-272706HEAT SINK, BGA, 27 X 27 X 6 MM Same Sky (Formerly CUI Devices) |
1,101 |
|
数据手册 |
HSB | Box | Active | Top Mount | BGA | Adhesive (Not Included) | Square, Pin Fins | 1.063" (27.00mm) | 1.063" (27.00mm) | - | 0.236" (6.00mm) | 3.8W @ 75°C | 7.80°C/W @ 200 LFM | 19.59°C/W | Aluminum Alloy | Black Anodized |
|
HSB03-121218HEAT SINK, BGA, 12 X 12 X 18 MM Same Sky (Formerly CUI Devices) |
1,500 |
|
数据手册 |
HSB | Tray | Active | Top Mount | BGA | Adhesive (Not Included) | Square, Pin Fins | 0.472" (12.00mm) | 0.472" (12.00mm) | - | 0.709" (18.00mm) | 3.1W @ 75°C | 9.60°C/W @ 200 LFM | 24.01°C/W | Aluminum Alloy | Black Anodized |
|
HSB09-212115HEAT SINK, BGA, 21 X 21 X 15 MM Same Sky (Formerly CUI Devices) |
2,583 |
|
数据手册 |
HSB | Box | Active | Top Mount | BGA | Adhesive (Not Included) | Square, Pin Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | - | 0.591" (15.00mm) | 4.3W @ 75°C | 6.00°C/W @ 200 LFM | 17.39°C/W | Aluminum Alloy | Black Anodized |
|
HSS24-B20-NPHEAT SINK, STAMPING, TO-218/TO-2 Same Sky (Formerly CUI Devices) |
2,779 |
|
数据手册 |
HSS | Box | Active | Top Mount | TO-218, TO-220 | Bolt On | Rectangular, Fins | 1.654" (42.00mm) | 1.496" (38.00mm) | - | 0.984" (25.00mm) | 7.85W @ 75°C | 4.30°C/W @ 200 LFM | 9.56°C/W | Aluminum Alloy | Black Anodized |
|
HSE-B20350-NPHEAT SINK, EXTRUSION, TO-220, 35 Same Sky (Formerly CUI Devices) |
1,436 |
|
数据手册 |
HSE | Tray | Active | Board Level | TO-220 | Bolt On | Rectangular, Fins | 1.378" (35.00mm) | 1.142" (29.00mm) | - | 0.472" (12.00mm) | 6.2W @ 75°C | 2.91°C/W @ 200 LFM | 12.10°C/W | Aluminum Alloy | Black Anodized |
|
HSE-B20380-040HHEAT SINK, EXTRUSION, TO-220, 38 Same Sky (Formerly CUI Devices) |
1,254 |
|
数据手册 |
HSE | Tray | Active | Board Level, Vertical | TO-220 | Bolt On and PC Pin | Rectangular, Angled Fins | 1.496" (38.00mm) | 1.378" (35.00mm) | - | 0.492" (12.50mm) | 7.4W @ 75°C | 3.94°C/W @ 200 LFM | 10.14°C/W | Aluminum Alloy | Black Anodized |
|
HSB06-181810HEAT SINK, BGA, 18 X 18 X 10 MM Same Sky (Formerly CUI Devices) |
1,111 |
|
数据手册 |
HSB | Box | Active | Top Mount | BGA | Adhesive (Not Included) | Square, Pin Fins | 0.709" (18.00mm) | 0.709" (18.00mm) | - | 0.394" (10.00mm) | 3.2W @ 75°C | 18.80°C/W @ 200 LFM | 23.68°C/W | Aluminum Alloy | Black Anodized |
