全球电子元器件供应链解决方案商
上传BOM单
IC 插座
| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
7100285589TEXTOOLFLEXIBLE ARRAY SOLUTIONS |
4,038 |
|
数据手册 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
1040-2-1517-0B-00TEXTOOLTEST & BURN-IN BALL GRID |
2,399 |
|
数据手册 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
7100229933TEXTOOL TEST & BURN BALL GRID AR |
2,879 |
|
数据手册 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
1035-2-1152-0B-00TEXTOOLTEST & BURN-IN BALL GRID |
2,202 |
|
数据手册 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
1025-2-0572-0B-00TEXTOOLTEST & BURN-IN BALL GRID |
1,370 |
|
数据手册 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
84-537-21-7CONN SOCKET PLCC ZIF 84POS GOLD |
3,248 |
|
数据手册 |
537 | - | Active | PLCC, ZIF (ZIP) | 84 (4 x 21) | 0.100" (2.54mm) | Gold | 12.0µin (0.30µm) | - | - | Closed Frame | - | - | - | - | - | - | - |
|
|
209-PGM17030-11CONN SOCKET PGA GOLD |
3,127 |
|
数据手册 |
PGM | Bulk | Active | PGA | - | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
|
|
209-PGM17046-11CONN SOCKET PGA GOLD |
4,894 |
|
数据手册 |
PGM | Bulk | Active | PGA | - | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
|
|
79300-20-0093M TEXTOOL FLEXIBLE ARRAY SOLUTI |
2,090 |
|
数据手册 |
Textool™ | Bulk | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
S583-11-255-01-005410255 POSITION BGA SOCKET LOADED W |
4,761 |
|
数据手册 |
* | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
7100287881TEXTOOLFLEXIBLE ARRAY SOLUTIONS |
2,768 |
|
数据手册 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
7010390893983-10 DOT IN-LN2"ES 6"X150YD-IN |
2,572 |
|
数据手册 |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
523-93-144-15-082001PGA SOCK 144PIN 15X15 WIRE WRAP |
3,555 |
|
数据手册 |
523 | Bulk | Active | PGA | 144 (15 x 15) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - |
|
|
523-93-114-13-062001PGA SOCK 114PIN 13X13 WIRE WRAP |
1,060 |
|
数据手册 |
523 | Bulk | Active | PGA | 114 (13 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - |
|
2-640357-4CONN IC DIP SOCKET 14POS GOLD |
1,636 |
|
数据手册 |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
|
2-640358-4CONN IC DIP SOCKET 16POS GOLD |
3,999 |
|
数据手册 |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
|
2-640359-4CONN IC DIP SOCKET 18POS GOLD |
2,088 |
|
数据手册 |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic | -55°C ~ 125°C |
|
2-640464-4CONN IC DIP SOCKET 20POS GOLD |
1,442 |
|
数据手册 |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
|
2-640362-4CONN IC DIP SOCKET 28POS GOLD |
3,948 |
|
数据手册 |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
|
2-640379-4CONN IC DIP SOCKET 40POS GOLD |
2,413 |
|
数据手册 |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
