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| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
210-88-628-41-001000STANDRD SOLDER TAIL DIP SOCKET |
1,293 |
|
数据手册 |
- | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
110-88-628-41-001000STANDRD SOLDER TAIL DIP SOCKET |
2,597 |
|
数据手册 |
- | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
110-33-308-41-530000CONN IC SKT DBL |
4,105 |
|
数据手册 |
110 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
110-83-314-41-001000STANDRD SOLDER TAIL DIP SOCKET |
3,735 |
|
数据手册 |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Thermoplastic | -55°C ~ 125°C |
|
|
210-83-314-41-001000STANDRD SOLDER TAIL DIP SOCKET |
1,361 |
|
数据手册 |
210 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 300.0µin (7.62µm) | Brass | Thermoplastic | -55°C ~ 125°C |
|
|
32-6574-16CONN IC DIP SOCKET ZIF 32POS TIN |
2,602 |
|
数据手册 |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
28-3551-16CONN IC DIP SOCKET ZIF 28POS |
3,926 |
|
数据手册 |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
28-3553-16CONN IC DIP SOCKET ZIF 28POS |
2,826 |
|
数据手册 |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
28-6551-16CONN IC DIP SOCKET ZIF 28POS |
1,353 |
|
数据手册 |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
558-10-352M26-001101PGA SOLDER TAIL 1.27MM |
1,288 |
|
数据手册 |
558 | Bulk | Active | PGA | 352 (26 x 26) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
110-83-316-41-001000STANDRD SOLDER TAIL DIP SOCKET |
1,383 |
|
数据手册 |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Thermoplastic | -55°C ~ 125°C |
|
|
210-83-316-41-001000STANDRD SOLDER TAIL DIP SOCKET |
2,048 |
|
数据手册 |
210 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 300.0µin (7.62µm) | Brass | Thermoplastic | -55°C ~ 125°C |
|
|
110-83-320-41-001000STANDRD SOLDER TAIL DIP SOCKET |
1,092 |
|
数据手册 |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Thermoplastic | -55°C ~ 125°C |
|
|
210-83-320-41-001000STANDRD SOLDER TAIL DIP SOCKET |
2,319 |
|
数据手册 |
210 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 300.0µin (7.62µm) | Brass | Thermoplastic | -55°C ~ 125°C |
|
|
514-83-400M20-000148CONN SOCKET BGA 400POS GOLD |
3,318 |
|
数据手册 |
514 | Bulk | Active | BGA | 400 (20 x 20) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
110-88-640-41-001000STANDRD SOLDER TAIL DIP SOCKET |
4,635 |
|
数据手册 |
- | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
210-88-640-41-001000STANDRD SOLDER TAIL DIP SOCKET |
4,219 |
|
数据手册 |
- | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
210-83-632-41-101000CONN IC SKT DBL |
2,190 |
|
数据手册 |
210 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 300.0µin (7.62µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
32-3570-16CONN IC DIP SOCKET ZIF 32POS |
1,293 |
|
数据手册 |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
32-3571-16CONN IC DIP SOCKET ZIF 32POS |
2,897 |
|
数据手册 |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled | - |
