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IC 插座
| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
APH-1928-G-TAPH-1928-G-T |
4,911 |
|
数据手册 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-0228-G-TAPH-0228-G-T |
1,719 |
|
数据手册 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1128-G-TAPH-1128-G-T |
4,864 |
|
数据手册 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-0328-G-TAPH-0328-G-T |
2,161 |
|
数据手册 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
116-43-952-61-007000CONN IC SKT DBL |
3,213 |
|
数据手册 |
116 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 52 (2 x 26) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
116-93-952-61-007000CONN IC SKT DBL |
4,584 |
|
数据手册 |
116 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 52 (2 x 26) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
APH-1926-G-RAPH-1926-G-R |
4,280 |
|
数据手册 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1426-G-RAPH-1426-G-R |
2,650 |
|
数据手册 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-0326-G-RAPH-0326-G-R |
3,411 |
|
数据手册 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1726-G-RAPH-1726-G-R |
4,105 |
|
数据手册 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-0226-G-RAPH-0226-G-R |
1,294 |
|
数据手册 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1226-G-RAPH-1226-G-R |
1,153 |
|
数据手册 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
HLS-0420-T-12.100" SCREW MACHINE SOCKET ARRAY |
4,886 |
|
数据手册 |
HLS | Bulk | Active | SIP | 80 (4 x 20) | 0.100" (2.54mm) | Tin | - | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | - | - | Thermoplastic | -55°C ~ 140°C |
|
|
116-43-648-61-001000CONN IC SKT DBL |
3,971 |
|
数据手册 |
116 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
116-93-648-61-001000CONN IC SKT DBL |
4,198 |
|
数据手册 |
116 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
40-C300-21CONN IC DIP SOCKET 40POS GOLD |
4,076 |
|
数据手册 |
EJECT-A-DIP™ | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
|
|
42-3570-11CONN IC DIP SOCKET ZIF 42POS GLD |
2,789 |
|
数据手册 |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
42-3571-11CONN IC DIP SOCKET ZIF 42POS GLD |
4,717 |
|
数据手册 |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
42-3572-11CONN IC DIP SOCKET ZIF 42POS GLD |
2,219 |
|
数据手册 |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
42-3573-11CONN IC DIP SOCKET ZIF 42POS GLD |
3,944 |
|
数据手册 |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
