IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 制造商型号 库存情况 价格 数量 数据手册 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
110-13-952-61-001000

110-13-952-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,758
110-13-952-61-001000

数据手册

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
42-6556-31

42-6556-31

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics

3,834
42-6556-31

数据手册

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
42-6556-21

42-6556-21

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics

3,898
42-6556-21

数据手册

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
714-43-262-31-018000

714-43-262-31-018000

CONN IC DIP SOCKET 62POS GOLD

Mill-Max Manufacturing Corp.

2,987
714-43-262-31-018000

数据手册

714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 62 (2 x 31) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APA-648-G-C

APA-648-G-C

ADAPTER PLUG

Samtec Inc.

2,244
APA-648-G-C

数据手册

APA Bulk Active - 48 (2 x 24) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APH-0432-G-H

APH-0432-G-H

APH-0432-G-H

Samtec Inc.

1,257
APH-0432-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0532-G-H

APH-0532-G-H

APH-0532-G-H

Samtec Inc.

2,555
APH-0532-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0632-G-H

APH-0632-G-H

APH-0632-G-H

Samtec Inc.

4,004
APH-0632-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0232-G-H

APH-0232-G-H

APH-0232-G-H

Samtec Inc.

3,355
APH-0232-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1332-G-H

APH-1332-G-H

APH-1332-G-H

Samtec Inc.

3,763
APH-1332-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0732-G-H

APH-0732-G-H

APH-0732-G-H

Samtec Inc.

3,751
APH-0732-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1132-G-H

APH-1132-G-H

APH-1132-G-H

Samtec Inc.

2,466
APH-1132-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1232-G-H

APH-1232-G-H

APH-1232-G-H

Samtec Inc.

4,078
APH-1232-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1732-G-H

APH-1732-G-H

APH-1732-G-H

Samtec Inc.

3,991
APH-1732-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1632-G-H

APH-1632-G-H

APH-1632-G-H

Samtec Inc.

2,721
APH-1632-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
117-93-764-61-005000

117-93-764-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,635
117-93-764-61-005000

数据手册

117 Tube Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-13-064-08-000001

510-13-064-08-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,011
510-13-064-08-000001

数据手册

510 Bulk Active PGA 64 (8 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APO-640-G-H

APO-640-G-H

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

3,150
APO-640-G-H

数据手册

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APH-1024-G-H

APH-1024-G-H

APH-1024-G-H

Samtec Inc.

4,719
APH-1024-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1124-G-H

APH-1124-G-H

APH-1124-G-H

Samtec Inc.

1,146
APH-1124-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
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