IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 制造商型号 库存情况 价格 数量 数据手册 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
123-13-650-41-001000

123-13-650-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

4,337
123-13-650-41-001000

数据手册

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-41-084-10-031001

510-41-084-10-031001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

4,538
510-41-084-10-031001

数据手册

510 Bulk Active PGA 84 (10 x 10) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
514-87-281-19-081117

514-87-281-19-081117

CONN SOCKET PGA 281POS GOLD

Preci-Dip

4,680
514-87-281-19-081117

数据手册

514 Bulk Active PGA 281 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
714-43-252-31-018000

714-43-252-31-018000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

4,787
714-43-252-31-018000

数据手册

714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
36-6503-31

36-6503-31

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

4,895
36-6503-31

数据手册

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
110-41-964-61-001000

110-41-964-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,115
110-41-964-61-001000

数据手册

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-93-650-61-001000

115-93-650-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,889
115-93-650-61-001000

数据手册

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-652-61-003000

116-43-652-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,100
116-43-652-61-003000

数据手册

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-648-61-007000

116-43-648-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,836
116-43-648-61-007000

数据手册

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-91-085-11-041003

510-91-085-11-041003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

1,878
510-91-085-11-041003

数据手册

510 Bulk Active PGA 85 (11 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-43-648-61-003000

115-43-648-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,884
115-43-648-61-003000

数据手册

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
517-83-364-17-091111

517-83-364-17-091111

CONN SOCKET PGA 364POS GOLD

Preci-Dip

4,787
517-83-364-17-091111

数据手册

517 Bulk Active PGA 364 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
122-11-952-41-001000

122-11-952-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,282
122-11-952-41-001000

数据手册

122 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-83-168-17-101112

614-83-168-17-101112

CONN SOCKET PGA 168POS GOLD

Preci-Dip

1,049
614-83-168-17-101112

数据手册

614 Bulk Active PGA 168 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
40-C182-20

40-C182-20

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2,402
40-C182-20

数据手册

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
APH-0428-G-T

APH-0428-G-T

APH-0428-G-T

Samtec Inc.

3,864
APH-0428-G-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0528-G-T

APH-0528-G-T

APH-0528-G-T

Samtec Inc.

3,111
APH-0528-G-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0928-G-T

APH-0928-G-T

APH-0928-G-T

Samtec Inc.

2,966
APH-0928-G-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0628-G-T

APH-0628-G-T

APH-0628-G-T

Samtec Inc.

4,498
APH-0628-G-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1228-G-T

APH-1228-G-T

APH-1228-G-T

Samtec Inc.

4,592
APH-1228-G-T

数据手册

* - Active - - - - - - - - - - - - - - -
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