IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部应用
全部重置
结果
图片 制造商型号 库存情况 价格 数量 数据手册 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
116-43-314-61-003000

116-43-314-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,499
116-43-314-61-003000

数据手册

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-314-61-003000

116-93-314-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,788
116-93-314-61-003000

数据手册

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
121-13-650-41-001000

121-13-650-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

4,441
121-13-650-41-001000

数据手册

121 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-632-61-006000

116-43-632-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,844
116-43-632-61-006000

数据手册

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-432-61-006000

116-93-432-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,897
116-93-432-61-006000

数据手册

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-632-61-006000

116-93-632-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,953
116-93-632-61-006000

数据手册

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
712-93-164-41-001000

712-93-164-41-001000

SOCKET CARRIER SIP 64POS

Mill-Max Manufacturing Corp.

4,073
712-93-164-41-001000

数据手册

712 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-640-61-105000

110-43-640-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,508
110-43-640-61-105000

数据手册

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-640-61-105000

110-93-640-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,321
110-93-640-61-105000

数据手册

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICO-640-BGG

ICO-640-BGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

2,080
ICO-640-BGG

数据手册

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-648-JGG

ICA-648-JGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

4,439
ICA-648-JGG

数据手册

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
110-93-652-61-001000

110-93-652-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,955
110-93-652-61-001000

数据手册

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
28-6508-212

28-6508-212

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

4,461
28-6508-212

数据手册

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
28-6508-312

28-6508-312

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

4,438
28-6508-312

数据手册

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
714-93-164-41-001000

714-93-164-41-001000

SOCKET CARRIER SIP 64POS

Mill-Max Manufacturing Corp.

3,806
714-93-164-41-001000

数据手册

714 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1422-G-H

APH-1422-G-H

APH-1422-G-H

Samtec Inc.

4,718
APH-1422-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0522-G-H

APH-0522-G-H

APH-0522-G-H

Samtec Inc.

3,173
APH-0522-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0622-G-H

APH-0622-G-H

APH-0622-G-H

Samtec Inc.

4,711
APH-0622-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1622-G-H

APH-1622-G-H

APH-1622-G-H

Samtec Inc.

1,037
APH-1622-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1222-G-H

APH-1222-G-H

APH-1222-G-H

Samtec Inc.

2,052
APH-1222-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
Search

搜索

OEM STOCK

产品

OEM STOCK

电话

OEM STOCK

用户