IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部应用
全部重置
结果
图片 制造商型号 库存情况 价格 数量 数据手册 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
116-91-650-41-006000

116-91-650-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,094
116-91-650-41-006000

数据手册

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-0838-T-T

APH-0838-T-T

APH-0838-T-T

Samtec Inc.

2,310
APH-0838-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1338-T-T

APH-1338-T-T

APH-1338-T-T

Samtec Inc.

1,269
APH-1338-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1438-T-T

APH-1438-T-T

APH-1438-T-T

Samtec Inc.

2,415
APH-1438-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1838-T-T

APH-1838-T-T

APH-1838-T-T

Samtec Inc.

3,266
APH-1838-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0538-T-T

APH-0538-T-T

APH-0538-T-T

Samtec Inc.

4,088
APH-0538-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1938-T-T

APH-1938-T-T

APH-1938-T-T

Samtec Inc.

1,643
APH-1938-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0938-T-T

APH-0938-T-T

APH-0938-T-T

Samtec Inc.

2,950
APH-0938-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1538-T-T

APH-1538-T-T

APH-1538-T-T

Samtec Inc.

4,821
APH-1538-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1038-T-T

APH-1038-T-T

APH-1038-T-T

Samtec Inc.

2,258
APH-1038-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0638-T-T

APH-0638-T-T

APH-0638-T-T

Samtec Inc.

3,827
APH-0638-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1138-T-T

APH-1138-T-T

APH-1138-T-T

Samtec Inc.

3,361
APH-1138-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0338-T-T

APH-0338-T-T

APH-0338-T-T

Samtec Inc.

4,326
APH-0338-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1238-T-T

APH-1238-T-T

APH-1238-T-T

Samtec Inc.

2,548
APH-1238-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1638-T-T

APH-1638-T-T

APH-1638-T-T

Samtec Inc.

2,763
APH-1638-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0738-T-T

APH-0738-T-T

APH-0738-T-T

Samtec Inc.

1,171
APH-0738-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0238-T-T

APH-0238-T-T

APH-0238-T-T

Samtec Inc.

4,567
APH-0238-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
44-3551-10

44-3551-10

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

2,322
44-3551-10

数据手册

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-3552-10

44-3552-10

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

4,910
44-3552-10

数据手册

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-3553-10

44-3553-10

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

4,583
44-3553-10

数据手册

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
Search

搜索

OEM STOCK

产品

OEM STOCK

电话

OEM STOCK

用户