IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 制造商型号 库存情况 价格 数量 数据手册 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
114-41-422-41-117000

114-41-422-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,766
114-41-422-41-117000

数据手册

114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
114-91-322-41-117000

114-91-322-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,866
114-91-322-41-117000

数据手册

114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
114-91-422-41-117000

114-91-422-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,030
114-91-422-41-117000

数据手册

114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-99-640-41-001000

210-99-640-41-001000

CONN IC DIP SOCKET 40POS TINLEAD

Mill-Max Manufacturing Corp.

3,556
210-99-640-41-001000

数据手册

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-44-640-41-001000

210-44-640-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

1,688
210-44-640-41-001000

数据手册

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-83-652-41-004101

116-83-652-41-004101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

4,772
116-83-652-41-004101

数据手册

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
317-43-111-41-005000

317-43-111-41-005000

CONN SKT STRIP

Mill-Max Manufacturing Corp.

1,796
317-43-111-41-005000

数据手册

317 Bulk Active SIP 11 (1 x 11) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-47-636-41-001000

110-47-636-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

1,667
110-47-636-41-001000

数据手册

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-41-310-41-001000

612-41-310-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

1,948
612-41-310-41-001000

数据手册

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-91-310-41-001000

612-91-310-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,739
612-91-310-41-001000

数据手册

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-47-422-41-003000

115-47-422-41-003000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

3,849
115-47-422-41-003000

数据手册

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-41-308-41-001000

612-41-308-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,030
612-41-308-41-001000

数据手册

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-91-308-41-001000

612-91-308-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,606
612-91-308-41-001000

数据手册

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
917-41-210-41-005000

917-41-210-41-005000

CONN SKT TRANSISTOR

Mill-Max Manufacturing Corp.

2,937
917-41-210-41-005000

数据手册

917 Tube Active Transistor, TO-100 10 (Round) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
917-91-210-41-005000

917-91-210-41-005000

CONN SKT TRANSISTOR

Mill-Max Manufacturing Corp.

1,869
917-91-210-41-005000

数据手册

917 Tube Active Transistor, TO-100 10 (Round) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
714-43-222-31-018000

714-43-222-31-018000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

3,533
714-43-222-31-018000

数据手册

714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-0608-G-H

APH-0608-G-H

APH-0608-G-H

Samtec Inc.

3,059
APH-0608-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0208-G-H

APH-0208-G-H

APH-0208-G-H

Samtec Inc.

3,699
APH-0208-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1708-G-H

APH-1708-G-H

APH-1708-G-H

Samtec Inc.

4,316
APH-1708-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0808-G-H

APH-0808-G-H

APH-0808-G-H

Samtec Inc.

1,483
APH-0808-G-H

数据手册

* - Active - - - - - - - - - - - - - - -
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