IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 制造商型号 库存情况 价格 数量 数据手册 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
317-91-109-41-005000

317-91-109-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

1,447
317-91-109-41-005000

数据手册

317 Bulk Active SIP 9 (1 x 9) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
40-6518-10E

40-6518-10E

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2,531
40-6518-10E

数据手册

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ICO-624-NGG

ICO-624-NGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

3,317
ICO-624-NGG

数据手册

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
317-43-104-41-005000

317-43-104-41-005000

CONN SKT STRIP

Mill-Max Manufacturing Corp.

3,990
317-43-104-41-005000

数据手册

317 Bulk Active SIP 4 (1 x 4) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-310-41-006000

116-93-310-41-006000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

4,999
116-93-310-41-006000

数据手册

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-310-41-006000

116-43-310-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,027
116-43-310-41-006000

数据手册

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-11-210-41-001000

110-11-210-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,137
110-11-210-41-001000

数据手册

110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
18-0501-21

18-0501-21

CONN SOCKET SIP 18POS GOLD

Aries Electronics

3,606
18-0501-21

数据手册

501 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
18-0501-31

18-0501-31

CONN SOCKET SIP 18POS GOLD

Aries Electronics

4,621
18-0501-31

数据手册

501 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
714-43-136-31-018000

714-43-136-31-018000

CONN SOCKET SIP 36POS GOLD

Mill-Max Manufacturing Corp.

3,285
714-43-136-31-018000

数据手册

714 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
146-93-308-41-012000

146-93-308-41-012000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

1,564
146-93-308-41-012000

数据手册

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-47-210-41-007000

116-47-210-41-007000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

4,967
116-47-210-41-007000

数据手册

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-47-318-41-001000

111-47-318-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

3,141
111-47-318-41-001000

数据手册

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
32-6503-20

32-6503-20

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,805
32-6503-20

数据手册

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
32-6503-30

32-6503-30

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

4,603
32-6503-30

数据手册

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
32-PGM07002-10

32-PGM07002-10

CONN SOCKET PGA GOLD

Aries Electronics

2,599
32-PGM07002-10

数据手册

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
317-47-111-41-005000

317-47-111-41-005000

STANDRD SOLDRTL SNG SKT

Mill-Max Manufacturing Corp.

2,187
317-47-111-41-005000

数据手册

317 Bulk Active SIP 11 (1 x 11) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
317-91-110-41-005000

317-91-110-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

2,138
317-91-110-41-005000

数据手册

317 Bulk Active SIP 10 (1 x 10) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICA-322-WGG-3

ICA-322-WGG-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

3,129
ICA-322-WGG-3

数据手册

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
116-83-648-41-004101

116-83-648-41-004101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

4,232
116-83-648-41-004101

数据手册

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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