IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 制造商型号 库存情况 价格 数量 数据手册 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
16-3503-31

16-3503-31

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,749
16-3503-31

数据手册

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
30-3503-20

30-3503-20

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3,742
30-3503-20

数据手册

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
30-3503-30

30-3503-30

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

1,464
30-3503-30

数据手册

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
210-11-310-41-001000

210-11-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,095
210-11-310-41-001000

数据手册

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-306-41-007000

116-93-306-41-007000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

2,085
116-93-306-41-007000

数据手册

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-306-41-007000

116-43-306-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,138
116-43-306-41-007000

数据手册

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0317-T-2

HLS-0317-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,435
HLS-0317-T-2

数据手册

HLS Tube Active SIP 51 (3 x 17) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
546-83-085-11-002135

546-83-085-11-002135

CONN SOCKET PGA 85POS GOLD

Preci-Dip

1,764
546-83-085-11-002135

数据手册

546 Bulk Active PGA 85 (11 x 11) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-83-085-11-002136

546-83-085-11-002136

CONN SOCKET PGA 85POS GOLD

Preci-Dip

3,513
546-83-085-11-002136

数据手册

546 Bulk Active PGA 85 (11 x 11) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
20-810-90TWR

20-810-90TWR

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

3,273
20-810-90TWR

数据手册

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
146-41-308-41-012000

146-41-308-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

4,827
146-41-308-41-012000

数据手册

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
146-91-308-41-012000

146-91-308-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

1,315
146-91-308-41-012000

数据手册

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
104-13-306-41-770000

104-13-306-41-770000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

3,097
104-13-306-41-770000

数据手册

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
110-43-210-41-001000

110-43-210-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,540
110-43-210-41-001000

数据手册

110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICA-320-ZWGG-2

ICA-320-ZWGG-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

2,409
ICA-320-ZWGG-2

数据手册

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICF-328-STL-I

ICF-328-STL-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

3,425
ICF-328-STL-I

数据手册

ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICF-628-STL-O

ICF-628-STL-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

4,900
ICF-628-STL-O

数据手册

ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICF-648-TL-O

ICF-648-TL-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

1,227
ICF-648-TL-O

数据手册

ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
APH-0918-T-T

APH-0918-T-T

APH-0918-T-T

Samtec Inc.

2,433
APH-0918-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1018-T-T

APH-1018-T-T

APH-1018-T-T

Samtec Inc.

3,485
APH-1018-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
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