上传BOM单
IC 插座
| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
A-ICS-254-16-TT50IC SOCKET, MACHINED PIN, 7.62MM, Assmann WSW Components |
4,861 |
|
数据手册 |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 | 0.100" (2.54mm) | Nickel | 78.7µin (2.00µm) | Beryllium Copper | Through Hole, Right Angle | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
AR40-HZL/07-TTCONN IC DIP SOCKET 40POS GOLD Assmann WSW Components |
4,157 |
|
数据手册 |
- | Bag | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
|
|
AJ 64-HZL-TSOCKET Assmann WSW Components |
2,883 |
|
数据手册 |
- | Bulk | Active | DIP, 0.75" (19.05mm) Row Spacing | 64 (2 x 32) | 0.070" (1.78mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | 196.9µin (5.00µm) | Brass | Polyphenylene Sulfide (PPS) | -40°C ~ 105°C |
|
|
AR 22-HZL/07/7-TTSOCKET Assmann WSW Components |
2,079 |
|
数据手册 |
AR | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
AR 28-HZL/07/7-TTCONN IC DIP SOCKET 28POS GOLD Assmann WSW Components |
4,034 |
|
数据手册 |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
|
AR 48 HZL/07-TTCONN IC DIP SOCKET 48POS GOLD Assmann WSW Components |
2,863 |
|
数据手册 |
- | Bag | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
|
|
A-ICS-254-18-TT50IC SOCKET, MACHINED PIN, 7.62MM, Assmann WSW Components |
2,072 |
|
数据手册 |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 | 0.100" (2.54mm) | Nickel | 78.7µin (2.00µm) | Beryllium Copper | Through Hole, Right Angle | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
|
AR 36-HZL/07-TTSOCKET Assmann WSW Components |
2,784 |
|
数据手册 |
AR | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
|
AR 40-HZL/07-TTCONN IC DIP SOCKET 40POS GOLD Assmann WSW Components |
4,617 |
|
数据手册 |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
|
|
AR 64-HZL/01-TTSOCKET Assmann WSW Components |
2,098 |
|
数据手册 |
AR | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
