上传BOM单
IC 插座
| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
A28-LC-7-TT-RCONN IC DIP SOCKET 28POS TIN Assmann WSW Components |
2,166 |
|
数据手册 |
- | Box | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT) | -55°C ~ 85°C |
|
AW 127-18/Z-TSOCKET 18 CONTACTS SINGLE ROW Assmann WSW Components |
1,768 |
|
数据手册 |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
A-CCS20-Z-SMCONN SOCKET PLCC 20POS TIN Assmann WSW Components |
2,945 |
|
数据手册 |
- | Bag | Obsolete | PLCC | 20 (4 x 5) | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
|
A20-LCGCONN IC DIP SOCKET 20POS GOLD Assmann WSW Components |
1,760 |
|
数据手册 |
- | - | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | Gold | - | - | - | - |
|
|
AW 127-19/Z-TSOCKET 19 CONTACTS SINGLE ROW Assmann WSW Components |
4,166 |
|
数据手册 |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
AR 22-HZL/7-TTSOCKET Assmann WSW Components |
2,754 |
|
数据手册 |
AR | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | Flash | Brass | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
A-CCS28-Z-SMCONN SOCKET PLCC 28POS TIN Assmann WSW Components |
1,157 |
|
数据手册 |
- | Bag | Obsolete | PLCC | 28 (4 x 7) | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
|
|
A18-LCGCONN IC DIP SOCKET 18POS GOLD Assmann WSW Components |
4,934 |
|
数据手册 |
- | - | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | Gold | - | - | - | - |
|
|
AW 127-20/Z-TSOCKET 20 CONTACTS SINGLE ROW Assmann WSW Components |
4,201 |
|
数据手册 |
- | Bulk | Active | SIP | 20 (1 x 20) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS) | -40°C ~ 105°C |
|
A-CCS32-Z-SMCONN SOCKET PLCC 32POS TIN Assmann WSW Components |
4,405 |
|
数据手册 |
- | Bag | Obsolete | PLCC | 32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
