上传BOM单
IC 插座
| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
05-0518-11HCONN SOCKET SIP 5POS GOLD Aries Electronics |
3,565 |
|
数据手册 |
518 | Bulk | Active | SIP | 5 (1 x 5) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
13-0518-10CONN SOCKET SIP 13POS GOLD Aries Electronics |
2,689 |
|
数据手册 |
518 | Bulk | Active | SIP | 13 (1 x 13) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
03-0508-30CONN SOCKET SIP 3POS GOLD Aries Electronics |
1,748 |
|
数据手册 |
508 | Bulk | Active | SIP | 3 (1 x 3) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 105°C |
|
10-2513-10TCONN IC DIP SOCKET 10POS GOLD Aries Electronics |
2,291 |
|
数据手册 |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
09-0518-11CONN SOCKET SIP 9POS GOLD Aries Electronics |
1,249 |
|
数据手册 |
518 | Bulk | Active | SIP | 9 (1 x 9) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
11-0518-10HCONN SOCKET SIP 11POS GOLD Aries Electronics |
2,373 |
|
数据手册 |
518 | Bulk | Active | SIP | 11 (1 x 11) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
12-0518-10TCONN SOCKET SIP 12POS GOLD Aries Electronics |
3,119 |
|
数据手册 |
518 | Bulk | Active | SIP | 12 (1 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
12-1518-10TCONN IC DIP SOCKET 12POS GOLD Aries Electronics |
3,474 |
|
数据手册 |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 12 (2 x 6) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
04-0513-11HCONN SOCKET SIP 4POS GOLD Aries Electronics |
2,034 |
|
数据手册 |
0513 | Bulk | Active | SIP | 4 (1 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
08-0513-10CONN SOCKET SIP 8POS GOLD Aries Electronics |
3,499 |
|
数据手册 |
0513 | Bulk | Active | SIP | 8 (1 x 8) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
