IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果
图片 制造商型号 库存情况 价格 数量 数据手册 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
614-87-422-31-012101

614-87-422-31-012101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

4,509
614-87-422-31-012101

数据手册

614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-308-41-013101

116-87-308-41-013101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

4,844
116-87-308-41-013101

数据手册

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APH-0502-T-T

APH-0502-T-T

APH-0502-T-T

Samtec Inc.

1,693
APH-0502-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1002-T-T

APH-1002-T-T

APH-1002-T-T

Samtec Inc.

4,937
APH-1002-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1502-T-T

APH-1502-T-T

APH-1502-T-T

Samtec Inc.

2,604
APH-1502-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1902-T-T

APH-1902-T-T

APH-1902-T-T

Samtec Inc.

1,208
APH-1902-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0602-T-T

APH-0602-T-T

APH-0602-T-T

Samtec Inc.

1,232
APH-0602-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1102-T-T

APH-1102-T-T

APH-1102-T-T

Samtec Inc.

1,534
APH-1102-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1602-T-T

APH-1602-T-T

APH-1602-T-T

Samtec Inc.

2,973
APH-1602-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0202-T-T

APH-0202-T-T

APH-0202-T-T

Samtec Inc.

1,267
APH-0202-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0302-T-T

APH-0302-T-T

APH-0302-T-T

Samtec Inc.

4,415
APH-0302-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0702-T-T

APH-0702-T-T

APH-0702-T-T

Samtec Inc.

1,276
APH-0702-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-0402-T-T

APH-0402-T-T

APH-0402-T-T

Samtec Inc.

4,135
APH-0402-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1802-T-T

APH-1802-T-T

APH-1802-T-T

Samtec Inc.

3,849
APH-1802-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
APH-1302-T-T

APH-1302-T-T

APH-1302-T-T

Samtec Inc.

1,841
APH-1302-T-T

数据手册

* - Active - - - - - - - - - - - - - - -
614-83-420-41-001101

614-83-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

4,656
614-83-420-41-001101

数据手册

614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-320-41-001101

614-83-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

4,757
614-83-320-41-001101

数据手册

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-324-41-003101

116-87-324-41-003101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

4,817
116-87-324-41-003101

数据手册

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-316-41-105191

110-83-316-41-105191

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

4,814
110-83-316-41-105191

数据手册

110 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-312-41-001101

116-83-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

4,620
116-83-312-41-001101

数据手册

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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