| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 可编程 | 存储类型 | 存储格式 | 技术 | 存储容量 | 存储组织 | 存储接口 | 时钟频率 | 写周期时间 - 字,页 | 访问时间 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
W958D8NBYA4I TRIC PSRAM 256MBIT HYPERBS 24TFBGA Winbond Electronics |
2,780 |
|
数据手册 |
- | 24-TBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | PSRAM | PSRAM (Pseudo SRAM) | 256Mbit | 32M x 8 | HyperBus | 250 MHz | 35ns | 28 ns | 1.7V ~ 2V | -40°C ~ 85°C (TC) | - | - | Surface Mount | 24-TFBGA, DDP (6x8) |
|
W949D2DBJX5I TRIC DRAM 512MBIT PAR 90VFBGA Winbond Electronics |
4,365 |
|
数据手册 |
- | 90-TFBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR | 512Mbit | 16M x 32 | Parallel | 200 MHz | 15ns | 5 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 90-VFBGA (8x13) |
|
W25Q256JWFIM TRIC FLASH 256MBIT SPI/QUAD 16SOIC Winbond Electronics |
4,340 |
|
数据手册 |
SpiFlash® | 16-SOIC (0.295", 7.50mm Width) | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 256Mbit | 32M x 8 | SPI - Quad I/O, QPI, DTR | 133 MHz | 5ms | 6 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 16-SOIC |
|
|
W631GU6NB-12IC DRAM 1GBIT 96-VFBGA Winbond Electronics |
4,352 |
|
数据手册 |
- | 96-VFBGA | Tray | Active | Not Verified | Volatile | DRAM | SDRAM - DDR3L | 1Gbit | 64M x 16 | - | 800 MHz | 15ns | 20 ns | 1.283V ~ 1.45V, 1.425V ~ 1.575V | 0°C ~ 95°C (TC) | - | - | Surface Mount | 96-VFBGA (7.5x13) |
|
W25Q256JVMIQIC FLASH 256MBIT SPI/QUAD 8WFLGA Winbond Electronics |
4,729 |
|
数据手册 |
SpiFlash® | 8-WLGA Exposed Pad | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 256Mbit | 32M x 8 | SPI - Quad I/O | 133 MHz | 3ms | 6 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 8-WFLGA (6x5) |
|
W25Q256JVMIMIC FLASH 256MBIT SPI/QUAD 8WFLGA Winbond Electronics |
2,028 |
|
数据手册 |
SpiFlash® | 8-WLGA Exposed Pad | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 256Mbit | 32M x 8 | SPI - Quad I/O | 133 MHz | 3ms | 6 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 8-WFLGA (6x5) |
|
W25Q256JVBIQ TRIC FLASH 256MBIT SPI 24TFBGA Winbond Electronics |
2,953 |
|
数据手册 |
SpiFlash® | 24-TBGA | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 256Mbit | 32M x 8 | SPI - Quad I/O | 133 MHz | 3ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 24-TFBGA (6x8) |
|
W25Q256JVCIQ TRIC FLASH 256MBIT SPI 24TFBGA Winbond Electronics |
3,683 |
|
数据手册 |
SpiFlash® | 24-TBGA | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 256Mbit | 32M x 8 | SPI - Quad I/O | 133 MHz | 3ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 24-TFBGA (6x8) |
|
W25Q256JVCIM TRIC FLASH 256MBIT SPI 24TFBGA Winbond Electronics |
4,556 |
|
数据手册 |
SpiFlash® | 24-TBGA | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 256Mbit | 32M x 8 | SPI - Quad I/O | 133 MHz | 3ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 24-TFBGA (6x8) |
|
W25R128JWSIQIC FLASH 128MBIT SPI 8SOIC Winbond Electronics |
3,842 |
|
数据手册 |
- | 8-SOIC (0.209", 5.30mm Width) | Tube | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 128Mbit | 16M x 8 | SPI | 104 MHz | - | - | 1.7V ~ 1.95V | -40°C ~ 85°C | - | - | Surface Mount | 8-SOIC |