| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 可编程 | 存储类型 | 存储格式 | 技术 | 存储容量 | 存储组织 | 存储接口 | 时钟频率 | 写周期时间 - 字,页 | 访问时间 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
W25Q128JVEIM TRIC FLASH 128MBIT SPI/QUAD 8WSON Winbond Electronics |
2,901 |
|
数据手册 |
SpiFlash® | 8-WDFN Exposed Pad | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 128Mbit | 16M x 8 | SPI - Quad I/O, QPI, DTR | 133 MHz | 3ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 8-WSON (8x6) |
|
|
W25Q128JWPIQ TRIC FLASH 128MBIT SPI/QUAD 8WSON Winbond Electronics |
6,249 |
|
数据手册 |
SpiFlash® | 8-WDFN Exposed Pad | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 128Mbit | 16M x 8 | SPI - Quad I/O | 133 MHz | -, 3ms | - | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 8-WSON (6x5) |
|
W9825G6KH-6IC DRAM 256MBIT PAR 54TSOP II Winbond Electronics |
6,596 |
|
数据手册 |
- | 54-TSOP (0.400", 10.16mm Width) | Tray | Active | Not Verified | Volatile | DRAM | SDRAM | 256Mbit | 16M x 16 | Parallel | 166 MHz | - | 5 ns | 3V ~ 3.6V | 0°C ~ 70°C (TA) | - | - | Surface Mount | 54-TSOP II |
|
W9825G6KH-6I TRIC DRAM 256MBIT PAR 54TSOP II Winbond Electronics |
1,498 |
|
数据手册 |
- | 54-TSOP (0.400", 10.16mm Width) | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM | 256Mbit | 16M x 16 | Parallel | 166 MHz | - | 5 ns | 3V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 54-TSOP II |
|
W9751G6NB25IIC DRAM 512MBIT PAR 84VFBGA Winbond Electronics |
7,024 |
|
数据手册 |
- | 84-VFBGA | Tray | Active | Not Verified | Volatile | DRAM | SDRAM - DDR2 | 512Mbit | 32M x 16 | Parallel | 400 MHz | 15ns | 57.5 ns | 1.7V ~ 1.9V | -40°C ~ 95°C (TC) | - | - | Surface Mount | 84-VFBGA (8x12.5) |
|
W971GG6NB-25 TRIC DRAM 1GBIT SSTL 18 84TFBGA Winbond Electronics |
2,044 |
|
数据手册 |
- | 84-TFBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM - DDR2 | 1Gbit | 64M x 16 | SSTL_18 | 400 MHz | 15ns | 57.5 ns | 1.7V ~ 1.9V | 0°C ~ 85°C (TC) | - | - | Surface Mount | 84-TFBGA (8x12.5) |
|
W25Q256JVFIQIC FLASH 256MBIT SPI/QUAD 16SOIC Winbond Electronics |
11,863 |
|
数据手册 |
SpiFlash® | 16-SOIC (0.295", 7.50mm Width) | Tray | Active | Verified | Non-Volatile | FLASH | FLASH - NOR | 256Mbit | 32M x 8 | SPI - Quad I/O | 133 MHz | 3ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 16-SOIC |
|
|
W25Q256JWPIMIC FLASH 256MBIT SPI/QUAD 8WSON Winbond Electronics |
549 |
|
数据手册 |
SpiFlash® | 8-WDFN Exposed Pad | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 256Mbit | 32M x 8 | SPI - Quad I/O, QPI, DTR | 133 MHz | 5ms | 6 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 8-WSON (6x5) |
|
W25Q256JVEIQIC FLASH 256MBIT SPI/QUAD 8WSON Winbond Electronics |
25,988 |
|
数据手册 |
SpiFlash® | 8-WDFN Exposed Pad | Tube | Active | Verified | Non-Volatile | FLASH | FLASH - NOR | 256Mbit | 32M x 8 | SPI - Quad I/O | 133 MHz | 3ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 8-WSON (8x6) |
|
W971GG6NB25IIC DRAM 1GBIT SSTL 18 84TFBGA Winbond Electronics |
4,696 |
|
数据手册 |
- | 84-TFBGA | Tray | Active | Not Verified | Volatile | DRAM | SDRAM - DDR2 | 1Gbit | 64M x 16 | SSTL_18 | 800 MHz | 15ns | 57.5 ns | 1.7V ~ 1.9V | -40°C ~ 95°C (TC) | - | - | Surface Mount | 84-TFBGA (8x12.5) |