| 图片 | 制造商型号 | 库存情况 | 数量 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 可编程 | 存储类型 | 存储格式 | 技术 | 存储容量 | 存储组织 | 存储接口 | 时钟频率 | 写周期时间 - 字,页 | 访问时间 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
W25N02KWTBIU TRIC FLASH 2GBIT SPI/QUAD 24TFBGA Winbond Electronics |
2,170 |
|
数据手册 |
SpiFlash® | 24-TBGA | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 2Gbit | 256M x 8 | SPI - Quad I/O | 104 MHz | 700µs | 8 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 24-TFBGA (8x6) |
|
W66AQ6NBQAHJIC DRAM 1GBIT LVSTL 200TFBGA Winbond Electronics |
2,001 |
|
数据手册 |
- | 200-TFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 1Gbit | 64M x 16 | LVSTL_06 | 2.133 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-TFBGA (10x14.5) |
|
W66AP6NBQAHJIC DRAM 1GBIT LVSTL 200TFBGA Winbond Electronics |
1,699 |
|
数据手册 |
- | 200-TFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 1Gbit | 64M x 16 | LVSTL_11 | 2.133 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-TFBGA (10x14.5) |
|
W632GU8QB09I TRIC DRAM 2GBIT PAR 78VFBGA Winbond Electronics |
1,491 |
|
数据手册 |
- | 78-VFBGA | Tape & Reel (TR) | Active | - | Volatile | DRAM | SDRAM - DDR3L | 2Gbit | 256M x 8 | Parallel | 1.067 GHz | 15ns | 20 ns | 1.283V ~ 1.45V | -40°C ~ 95°C (TC) | - | - | Surface Mount | 78-VFBGA (8x10.5) |
|
W632GU8NB15I TRIC DRAM 2GBIT PAR 78VFBGA Winbond Electronics |
1,043 |
|
数据手册 |
- | 78-VFBGA | Tape & Reel (TR) | Last Time Buy | Not Verified | Volatile | DRAM | SDRAM - DDR3L | 2Gbit | 256M x 8 | Parallel | 667 MHz | 15ns | 20 ns | 1.283V ~ 1.45V | -40°C ~ 95°C (TC) | - | - | Surface Mount | 78-VFBGA (8x10.5) |
|
W74M25JWZEIQ TRIC FLASH 256MBIT 104MHZ 8WSON Winbond Electronics |
1,050 |
|
数据手册 |
- | 8-WDFN Exposed Pad | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND | 256Mbit | 32M x 8 | - | 104 MHz | - | - | 1.7V ~ 1.95V | -40°C ~ 85°C | - | - | Surface Mount | 8-WSON (8x6) |
|
W63AH2NBVACI TRIC DRAM 1GBIT HSUL 12 178VFBGA Winbond Electronics |
3,282 |
|
数据手册 |
- | 178-VFBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR3 | 1Gbit | 32M x 32 | HSUL_12 | 933 MHz | 15ns | 5.5 ns | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -40°C ~ 85°C (TC) | - | - | Surface Mount | 178-VFBGA (11x11.5) |
|
W63AH6NBVACI TRIC DRAM 1GBIT HSUL 12 178VFBGA Winbond Electronics |
1,054 |
|
数据手册 |
- | 178-VFBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR3 | 1Gbit | 64M x 16 | HSUL_12 | 933 MHz | 15ns | 5.5 ns | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -40°C ~ 85°C (TC) | - | - | Surface Mount | 178-VFBGA (11x11.5) |
|
W66AP6NBUAGJIC DRAM 1GBIT LVSTL 200WFBGA Winbond Electronics |
4,515 |
|
数据手册 |
- | 200-WFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 1Gbit | 64M x 16 | LVSTL_11 | 1.867 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |
|
W66AQ6NBUAGJIC DRAM 1GBIT LVSTL 200WFBGA Winbond Electronics |
1,350 |
|
数据手册 |
- | 200-WFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 1Gbit | 64M x 16 | LVSTL_06 | 1.867 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | - | - | Surface Mount | 200-WFBGA (10x14.5) |