系统级芯片(SoC)

制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 闪存大小 RAM 大小 外设 连接性 速度 主要属性 工作温度 等级 认证 供应商设备封装

















































































































































































































































































































































































































































































































































































































































































































































全部应用
全部重置
结果
图片 制造商型号 库存情况 价格 数量 数据手册 系列 封装/外壳 包装 产品状态 架构 核心处理器 闪存大小 RAM 大小 外设 连接性 速度 主要属性 工作温度 等级 认证 供应商设备封装
XCVM1402-2MLEVSVD1760

XCVM1402-2MLEVSVD1760

IC VERSALPRIME ACAP FPGA 1760BGA

AMD

1,311
XCVM1402-2MLEVSVD1760

数据手册

Versal™ Prime 1760-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.4GHz Versal™ Prime FPGA, 1.2M Logic Cells 0°C ~ 100°C (TJ) - - 1760-FCBGA (40x40)
XCVM1502-2MSEVSVA2197

XCVM1502-2MSEVSVA2197

IC VERSALPRIME ACAP FPGA 2197BGA

AMD

1,730
XCVM1502-2MSEVSVA2197

数据手册

Versal™ Prime 2197-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.4GHz Versal™ Prime FPGA, 1M Logic Cells 0°C ~ 110°C (TJ) - - 2197-FCBGA (45x45)
XCVM1502-1MSIVSVA2197

XCVM1502-1MSIVSVA2197

IC VERSALPRIME ACAP FPGA 2197BGA

AMD

3,719
XCVM1502-1MSIVSVA2197

数据手册

Versal™ Prime 2197-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.3GHz Versal™ Prime FPGA, 1M Logic Cells -40°C ~ 110°C (TJ) - - 2197-FCBGA (45x45)
XCZU19EG-1FFVD1760I

XCZU19EG-1FFVD1760I

IC SOC CORTEX-A53 1760FCBGA

AMD

4,406
XCZU19EG-1FFVD1760I

数据手册

Zynq® UltraScale+™ MPSoC EG 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells -40°C ~ 100°C (TJ) - - 1760-FCBGA (42.5x42.5)
XCZU19EG-2FFVC1760E

XCZU19EG-2FFVC1760E

IC SOC CORTEX-A53 1760FCBGA

AMD

1,999
XCZU19EG-2FFVC1760E

数据手册

Zynq® UltraScale+™ MPSoC EG 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells 0°C ~ 100°C (TJ) - - 1760-FCBGA (42.5x42.5)
XCZU19EG-2FFVE1924E

XCZU19EG-2FFVE1924E

IC SOC CORTEX-A53 1924FCBGA

AMD

3,142
XCZU19EG-2FFVE1924E

数据手册

Zynq® UltraScale+™ MPSoC EG 1924-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells 0°C ~ 100°C (TJ) - - 1924-FCBGA (45x45)
XCZU19EG-L1FFVC1760I

XCZU19EG-L1FFVC1760I

IC SOC CORTEX-A53 1760FCBGA

AMD

1,096
XCZU19EG-L1FFVC1760I

数据手册

Zynq® UltraScale+™ MPSoC EG 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells -40°C ~ 100°C (TJ) - - 1760-FCBGA (42.5x42.5)
XCZU17EG-2FFVD1760E

XCZU17EG-2FFVD1760E

IC SOC CORTEX-A53 1760FCBGA

AMD

1,883
XCZU17EG-2FFVD1760E

数据手册

Zynq® UltraScale+™ MPSoC EG 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 926K+ Logic Cells 0°C ~ 100°C (TJ) - - 1760-FCBGA (42.5x42.5)
XCVM1802-1MSEVSVA2197

XCVM1802-1MSEVSVA2197

IC VERSAL AICORE FPGA 2197BGA

AMD

1,259
XCVM1802-1MSEVSVA2197

数据手册

Versal™ Prime 2197-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.3GHz Versal™ Prime FPGA, 1.9M Logic Cells 0°C ~ 100°C (TJ) - - 2197-FCBGA (45x45)
XCVM1402-2MSIVSVD1760

XCVM1402-2MSIVSVD1760

IC VERSALPRIME ACAP FPGA 1760BGA

AMD

1,938
XCVM1402-2MSIVSVD1760

数据手册

Versal™ Prime 1760-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.4GHz Versal™ Prime FPGA, 1.2M Logic Cells -40°C ~ 100°C (TJ) - - 1760-FCBGA (40x40)
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